Barbara Luther

Person

Cold Spring, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,593,660
- Issue date Jul 15, 2003
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via in copper/polyimide BEOL
- Patent number 6,590,290
- Issue date Jul 8, 2003
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,261,951
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Patent number 6,255,217
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Paul D. Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a stacked via in copper/polyimide beol
- Patent number 6,143,640
- Issue date Nov 7, 2000
- International Business Machines Corporation
- John E. Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic seal for encapsulation of an organic layer and method for...
- Patent number 5,861,658
- Issue date Jan 19, 1999
- International Business Machines Corporation
- John Edward Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic seal for encapsulation of an organic layer and method for...
- Patent number 5,854,141
- Issue date Dec 29, 1998
- International Business Machines Corporation
- John Edward Cronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing coplanar multi-level metal/insulator films on...
- Patent number 4,789,648
- Issue date Dec 6, 1988
- International Business Machines Corporation
- Melanie M. Chow
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Plasma treatment to enhance inorganic dielectric adhesion to copper
- Publication number 20010053591
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS

Barbara Luther

Person

Patents Grantslast 30 patents

Plasma treatment to enhance inorganic dielectric adhesion to copper

Stacked via in copper/polyimide BEOL

Plasma treatment to enhance inorganic dielectric adhesion to copper

Plasma treatment to enhance inorganic dielectric adhesion to copper

Method of fabricating a stacked via in copper/polyimide beol

Inorganic seal for encapsulation of an organic layer and method for...

Inorganic seal for encapsulation of an organic layer and method for...

Method for producing coplanar multi-level metal/insulator films on...

Patents Applicationslast 30 patents

Plasma treatment to enhance inorganic dielectric adhesion to copper