Barbara S. DEWITT

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D-microstrip branchline coupler
- Patent number 10,832,989
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Barbara S. DeWitt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D-microstrip branchline coupler
- Patent number 10,586,752
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Barbara S. DeWitt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D-microstrip branchline coupler
- Patent number 10,037,931
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Barbara S. DeWitt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D-microstrip branchline coupler
- Patent number 9,780,429
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Barbara S. DeWitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip vertical three dimensional microstrip line with characteris...
- Patent number 9,553,348
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Barbara S. Dewitt
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
On-chip vertical three dimensional microstrip line with characteris...
- Patent number 9,362,606
- Issue date Jun 7, 2016
- International Business Machines Corporation
- Barbara S. Dewitt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional branchline coupler using through silicon vias and...
- Patent number 9,035,719
- Issue date May 19, 2015
- International Business Machines Corporation
- Barbara S. Dewitt
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
3D-MICROSTRIP BRANCHLINE COUPLER
- Publication number 20200020612
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Barbara S. DeWITT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D-MICROSTRIP BRANCHLINE COUPLER
- Publication number 20180286785
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Barbara S. DeWITT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D-MICROSTRIP BRANCHLINE COUPLER
- Publication number 20170330821
- Publication date Nov 16, 2017
- International Business Machines Corporation
- Barbara S. DeWITT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D-MICROSTRIP BRANCHLINE COUPLER
- Publication number 20170110778
- Publication date Apr 20, 2017
- International Business Machines Corporation
- Barbara S. DeWITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERIS...
- Publication number 20160226123
- Publication date Aug 4, 2016
- University of South Carolina
- Barbara S. DEWITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL BRANCHLINE COUPLER USING THROUGH SILICON VIAS AND...
- Publication number 20150054595
- Publication date Feb 26, 2015
- University of South Carolina
- Barbara S. DEWITT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERIS...
- Publication number 20150054592
- Publication date Feb 26, 2015
- University of South Carolina
- Barbara S. DEWITT
- G06 - COMPUTING CALCULATING COUNTING

Barbara S. DEWITT

Person

Patents Grantslast 30 patents

3D-microstrip branchline coupler

3D-microstrip branchline coupler

3D-microstrip branchline coupler

3D-microstrip branchline coupler

On-chip vertical three dimensional microstrip line with characteris...

On-chip vertical three dimensional microstrip line with characteris...

Three dimensional branchline coupler using through silicon vias and...

Patents Applicationslast 30 patents

3D-MICROSTRIP BRANCHLINE COUPLER

3D-MICROSTRIP BRANCHLINE COUPLER

3D-MICROSTRIP BRANCHLINE COUPLER

3D-MICROSTRIP BRANCHLINE COUPLER

ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERIS...

THREE DIMENSIONAL BRANCHLINE COUPLER USING THROUGH SILICON VIAS AND...

ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERIS...