Barbara Vasquez

Person

Lafayette, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked die module
- Patent number 8,324,725
- Issue date Dec 4, 2012
- FormFactor, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component, especially a memory chip
- Patent number 7,338,843
- Issue date Mar 4, 2008
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a component module
- Patent number 7,211,451
- Issue date May 1, 2007
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having at least one semiconductor chip and fli...
- Patent number 7,176,131
- Issue date Feb 13, 2007
- Infineon Technologies AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating connection regions of an integrated circuit,...
- Patent number 7,087,512
- Issue date Aug 8, 2006
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit module and method for fabricating semiconduct...
- Patent number 7,074,696
- Issue date Jul 11, 2006
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor component having a compliant bu...
- Patent number 6,953,708
- Issue date Oct 11, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor chip
- Patent number 6,919,232
- Issue date Jul 19, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection of integrated circuit to a substrate
- Patent number 6,916,185
- Issue date Jul 12, 2005
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor device and corresponding semic...
- Patent number 6,905,954
- Issue date Jun 14, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connection of circuit units
- Patent number 6,845,554
- Issue date Jan 25, 2005
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component having a plurality of...
- Patent number 6,714,418
- Issue date Mar 30, 2004
- Infineon Technologies AG
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Component Having at Least One Semiconductor Chip and Fli...
- Publication number 20070102826
- Publication date May 10, 2007
- Infineon Technologies AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating connection regions of an integrated circuit,...
- Publication number 20060244109
- Publication date Nov 2, 2006
- Infineon Technologies AG, a German corporation
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Module
- Publication number 20060076690
- Publication date Apr 13, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating connection regions of an integrated circuit,...
- Publication number 20050250304
- Publication date Nov 10, 2005
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component having at least one semiconductor chip and fli...
- Publication number 20050110162
- Publication date May 26, 2005
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing an electronic component, especially a memory chip
- Publication number 20050048676
- Publication date Mar 3, 2005
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having a compliant buffer layer
- Publication number 20040113270
- Publication date Jun 17, 2004
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor device and corresponding semic...
- Publication number 20040070085
- Publication date Apr 15, 2004
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection of integrated circuit to a substrate
- Publication number 20040036181
- Publication date Feb 26, 2004
- Harry Hedler
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of producing semiconductor chips with a chip edge guard, in...
- Publication number 20030143819
- Publication date Jul 31, 2003
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connection of circuit units
- Publication number 20030110628
- Publication date Jun 19, 2003
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electronic component having a plurality of...
- Publication number 20030112610
- Publication date Jun 19, 2003
- Gerd Frankowsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing a component module
- Publication number 20030109072
- Publication date Jun 12, 2003
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing a semiconductor chip
- Publication number 20030094695
- Publication date May 22, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-adhering chip
- Publication number 20030035276
- Publication date Feb 20, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS

Barbara Vasquez

Person

Patents Grantslast 30 patents

Stacked die module

Method for producing an electronic component, especially a memory chip

Process for producing a component module

Electronic component having at least one semiconductor chip and fli...

Method for fabricating connection regions of an integrated circuit,...

Semiconductor circuit module and method for fabricating semiconduct...

Method of producing a semiconductor component having a compliant bu...

Process for producing a semiconductor chip

Connection of integrated circuit to a substrate

Method for producing a semiconductor device and corresponding semic...

Method for connection of circuit units

Method for producing an electronic component having a plurality of...

Patents Applicationslast 30 patents

Electronic Component Having at Least One Semiconductor Chip and Fli...

Method for fabricating connection regions of an integrated circuit,...

Stacked Die Module

Method for fabricating connection regions of an integrated circuit,...

Electronic component having at least one semiconductor chip and fli...

Method for producing an electronic component, especially a memory chip

Semiconductor component having a compliant buffer layer

Method for producing a semiconductor device and corresponding semic...

Connection of integrated circuit to a substrate

Method of producing semiconductor chips with a chip edge guard, in...

Method for connection of circuit units

Method for producing an electronic component having a plurality of...

Process for producing a component module

Process for producing a semiconductor chip

Self-adhering chip