Barbara Vasquez

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Compliant relief wafer level packaging
- Patent number 6,888,256
- Issue date May 3, 2005
- Infineon Technologies AG
- Harry Hedler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method producing a contact connection between a semiconductor chip...
- Patent number 6,861,291
- Issue date Mar 1, 2005
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structure
- Patent number 6,826,037
- Issue date Nov 30, 2004
- Infineon Technologies AG
- Harry Hedler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-adhering chip
- Patent number 6,756,540
- Issue date Jun 29, 2004
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, memory module and method for testing the semico...
- Patent number 6,744,127
- Issue date Jun 1, 2004
- Infineon Technologies AG
- Harry Hedler
- G11 - INFORMATION STORAGE
Information Patent Grant
Transfer wafer level packaging
- Patent number 6,727,576
- Issue date Apr 27, 2004
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying a bottom surface protective coating to a wafer,...
- Patent number 6,709,953
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Barbara Vasquez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse programmable I/O organization
- Patent number 6,707,746
- Issue date Mar 16, 2004
- Infineon Technologies AG
- Gerd Frankowsky
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of making pad-rerouting for integrated circuit chips
- Patent number 6,664,176
- Issue date Dec 16, 2003
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a structure on a wafer
- Patent number 6,638,870
- Issue date Oct 28, 2003
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a thin, free-standing semiconductor device l...
- Patent number 6,521,512
- Issue date Feb 18, 2003
- Infineon Technologies AG
- Barbara Vasquez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method producing a contact connection between a semiconductor chip...
- Publication number 20030201452
- Publication date Oct 30, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of applying a bottom surface protective coating to a wafer,...
- Publication number 20030143818
- Publication date Jul 31, 2003
- Barbara Vasquez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a structure on a wafer
- Publication number 20030129841
- Publication date Jul 10, 2003
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer wafer level packaging
- Publication number 20030080399
- Publication date May 1, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant relief wafer level packaging
- Publication number 20030080425
- Publication date May 1, 2003
- Harry Hedler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pad- rerouting for integrated circuit chips
- Publication number 20030042620
- Publication date Mar 6, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fuse programmable I/O organization
- Publication number 20030026159
- Publication date Feb 6, 2003
- Infineon Technologies North America Corp.
- Gerd Frankowsky
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor chip, memory module and method for testing the semico...
- Publication number 20030001236
- Publication date Jan 2, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic structure
- Publication number 20020181218
- Publication date Dec 5, 2002
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a thin, free-standing semiconductor device l...
- Publication number 20020048955
- Publication date Apr 25, 2002
- Barbara Vasquez
- H01 - BASIC ELECTRIC ELEMENTS

Barbara Vasquez

Person

Patents Grantslast 30 patents

Compliant relief wafer level packaging

Method producing a contact connection between a semiconductor chip...

Electronic structure

Self-adhering chip

Semiconductor chip, memory module and method for testing the semico...

Transfer wafer level packaging

Method of applying a bottom surface protective coating to a wafer,...

Fuse programmable I/O organization

Method of making pad-rerouting for integrated circuit chips

Forming a structure on a wafer

Method for fabricating a thin, free-standing semiconductor device l...

Patents Applicationslast 30 patents

Method producing a contact connection between a semiconductor chip...

Method of applying a bottom surface protective coating to a wafer,...

Forming a structure on a wafer

Transfer wafer level packaging

Compliant relief wafer level packaging

Pad- rerouting for integrated circuit chips

Fuse programmable I/O organization

Semiconductor chip, memory module and method for testing the semico...

Electronic structure

Method for fabricating a thin, free-standing semiconductor device l...