Membership
Tour
Register
Log in
Barry A. Bonitz
Follow
Person
Endwell, NY, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Packaging integrated circuits with adhesive posts
Patent number
7,094,966
Issue date
Aug 22, 2006
International Business Machines Corporation
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adjusting fillet geometry to couple a heat spreader to a chip carrier
Patent number
6,984,286
Issue date
Jan 10, 2006
International Business Machines Corporation
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adjusting fillet geometry to couple a heat spreader to a chip carrier
Patent number
6,545,869
Issue date
Apr 8, 2003
International Business Machines Corporation
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making an electronic package assembly with protective enc...
Patent number
5,414,928
Issue date
May 16, 1995
International Business Machines Corporation
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION
Publication number
20120243147
Publication date
Sep 27, 2012
Endicott Interconnect Technologies, Inc.
Francesco F. Marconi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Packaging integrated circuits with adhesive posts
Publication number
20040075990
Publication date
Apr 22, 2004
International Business Machines Corporation
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adjusting fillet geometry to couple a heat spreader to a chip carrier
Publication number
20030101582
Publication date
Jun 5, 2003
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adjusting fillet geometry to couple a heat spreader to a chip carrier
Publication number
20020141160
Publication date
Oct 3, 2002
Barry A. Bonitz
H01 - BASIC ELECTRIC ELEMENTS