Membership
Tour
Register
Log in
Barry C. Snyder
Follow
Person
Bend, OR, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Bonded structures formed by plasma enhanced bonding
Patent number
8,174,094
Issue date
May 8, 2012
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method for plasma enhanced bonding and bonded structures formed by...
Patent number
7,563,691
Issue date
Jul 21, 2009
Hewlett-Packard Development Company, L.P.
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
7,432,582
Issue date
Oct 7, 2008
Hewlett-Packard Development Company, L.P.
Diane Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
6,902,872
Issue date
Jun 7, 2005
Hewlett-Packard Development Company, L.P.
Diane Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Method of forming a through-substrate interconnect
Patent number
6,716,737
Issue date
Apr 6, 2004
Hewlett-Packard Development Company, L.P.
Hubert Vander Plas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple redundant through hole electrical interconnects and method...
Patent number
6,659,592
Issue date
Dec 9, 2003
Hewlett-Packard Development Company, L.P.
Hubert Allen Vander Plas
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Patents Applications
last 30 patents
Information
Patent Application
Bonded structures formed by plasma enhanced bonding
Publication number
20090256882
Publication date
Oct 15, 2009
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Conductive trace formation via wicking action
Publication number
20060213957
Publication date
Sep 28, 2006
Cary G. Addington
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for plasma enhanced bonding and bonded structures formed by...
Publication number
20060093787
Publication date
May 4, 2006
Chien-Hua Chen
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method of forming a through-substrate interconnect
Publication number
20050101040
Publication date
May 12, 2005
Daine Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE INTERCONNECT
Publication number
20040018712
Publication date
Jan 29, 2004
Hubert Vander Plas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming a through-substrate interconnect
Publication number
20040017419
Publication date
Jan 29, 2004
Diane Lai
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Multiple redundant through hole electrical interconnects and method...
Publication number
20030035027
Publication date
Feb 20, 2003
Hubert Allen Vander Plas
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS