Bart Swinnen

Person

Holsbeek, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing contact areas on a semiconductor substrate
- Patent number 10,332,850
- Issue date Jun 25, 2019
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through-substrate vias
- Patent number 9,646,930
- Issue date May 9, 2017
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating through substrate vias
- Patent number 8,809,188
- Issue date Aug 19, 2014
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC interconnect
- Patent number 8,076,768
- Issue date Dec 13, 2011
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating via first plus via last IC interconnect
- Patent number 7,985,620
- Issue date Jul 26, 2011
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via first plus via last technique for IC interconnects
- Patent number 7,939,926
- Issue date May 10, 2011
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a die or substrate to a carrier
- Patent number 7,795,113
- Issue date Sep 14, 2010
- IMEC
- Bart Swinnen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chip singulation
- Patent number 7,566,634
- Issue date Jul 28, 2009
- Interuniversitair Microelektronica Centrum (IMEC)
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIAS
- Publication number 20150035168
- Publication date Feb 5, 2015
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Contact Areas on a Semiconductor Substrate
- Publication number 20140374919
- Publication date Dec 25, 2014
- IMEC
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING THROUGH SUBSTRATE VIAS
- Publication number 20110089572
- Publication date Apr 21, 2011
- IMEC
- Deniz Sabuncuoglu Tezcan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Interconnect
- Publication number 20110042829
- Publication date Feb 24, 2011
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ELECTRICAL INTERCONNECTS AND DEVICES MADE THEREOF
- Publication number 20100264538
- Publication date Oct 21, 2010
- IMEC
- Bart Swinnen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via First Plus Via Last Technique for IC Interconnect
- Publication number 20100261310
- Publication date Oct 14, 2010
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via First Plus Via Last Technique for IC Interconnects
- Publication number 20100148371
- Publication date Jun 17, 2010
- QUALCOMM Incorporated
- Kenneth Kaskoun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A DIE OR SUBSTRATE TO A CARRIER
- Publication number 20080166525
- Publication date Jul 10, 2008
- Interuniversitair Microelektronica Centrum (IMEC)
- Bart Swinnen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for chip singulation
- Publication number 20060068567
- Publication date Mar 30, 2006
- Eric Beyne
- H01 - BASIC ELECTRIC ELEMENTS

Bart Swinnen

Person

Patents Grantslast 30 patents

Method for producing contact areas on a semiconductor substrate

Semiconductor device having through-substrate vias

Method for fabricating through substrate vias

IC interconnect

Method of fabricating via first plus via last IC interconnect

Via first plus via last technique for IC interconnects

Method for bonding a die or substrate to a carrier

Method for chip singulation

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING THROUGH-SUBSTRATE VIAS

Method for Producing Contact Areas on a Semiconductor Substrate

METHOD FOR FABRICATING THROUGH SUBSTRATE VIAS

IC Interconnect

METHOD FOR PRODUCING ELECTRICAL INTERCONNECTS AND DEVICES MADE THEREOF

Via First Plus Via Last Technique for IC Interconnect

Via First Plus Via Last Technique for IC Interconnects

METHOD FOR BONDING A DIE OR SUBSTRATE TO A CARRIER

Method for chip singulation