Bart Vandevelde

Follow

Person

Leuven, BE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for bonding semiconductor substrates
- Patent number 9,105,827
- Issue date Aug 11, 2015
- IMEC
- Nga Phuong Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor substrates
- Patent number 8,772,131
- Issue date Jul 8, 2014
- IMEC
- Nga Phuong Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for cooling integrated circuits
- Patent number 8,493,736
- Issue date Jul 23, 2013
- IMEC
- Herman Oprins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20140312359
- Publication date Oct 23, 2014
- Nga Phuong Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20130134436
- Publication date May 30, 2013
- IMEC
- Nga Phuong Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR COOLING INTEGRATED CIRCUITS
- Publication number 20110304987
- Publication date Dec 15, 2011
- IMEC
- Herman Oprins
- H01 - BASIC ELECTRIC ELEMENTS