Bartholomew Liao

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 9,627,338
- Issue date Apr 18, 2017
- STATS ChipPAC Pte. Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL and vertical interco...
- Patent number 9,330,994
- Issue date May 3, 2016
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with under bump metallization a...
- Patent number 9,202,793
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20170186660
- Publication date Jun 29, 2017
- STATS ChipPAC Pte Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL and Vertical Interco...
- Publication number 20150279778
- Publication date Oct 1, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD...
- Publication number 20150179602
- Publication date Jun 25, 2015
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Ultra High Density Embed...
- Publication number 20140252641
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS