Bartlet H. DeProspo

Person

Goshen, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,574,864
- Issue date Feb 7, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,056,429
- Issue date Jul 6, 2021
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic rigidity mechanism
- Patent number 10,912,986
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Benjamin D. Briggs
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Self-aligned airgaps with conductive lines and vias
- Patent number 10,784,156
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Location-specific laser annealing to improve interconnect microstru...
- Patent number 10,770,348
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Benjamin David Briggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of implementing a directed self-assembled security pattern
- Patent number 10,752,039
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Benjamin David Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 10,629,529
- Issue date Apr 21, 2020
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Location-specific laser annealing to improve interconnect microstru...
- Patent number 10,559,498
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Benjamin David Briggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced self-alignment of vias for a semiconductor device
- Patent number 10,515,894
- Issue date Dec 24, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 10,366,952
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Location-specific laser annealing to improve interconnect microstru...
- Patent number 10,366,920
- Issue date Jul 30, 2019
- International Business Machines Corporation
- Benjamin David Briggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure, system, method, and recording medium of implementing a d...
- Patent number 10,315,451
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Benjamin David Briggs
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
High-density MIM capacitors
- Patent number 10,229,967
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced self-alignment of vias for asemiconductor device
- Patent number 10,211,151
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, system, method, and recording medium of implementing a d...
- Patent number 10,150,323
- Issue date Dec 11, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 10,109,579
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic rigidity mechanism
- Patent number 10,099,108
- Issue date Oct 16, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Skip-vias bypassing a metallization level at minimum pitch
- Patent number 10,083,905
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 9,997,451
- Issue date Jun 12, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip-vias bypassing a metallization level at minimum pitch
- Patent number 9,911,651
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned airgaps with conductive lines and vias
- Patent number 9,899,256
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and fabrication method for enhanced mechanical strength c...
- Patent number 9,899,338
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security key system
- Patent number 9,881,431
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- G07 - CHECKING-DEVICES
Information Patent Grant
High-density MIM capacitors
- Patent number 9,837,485
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming deep airgaps without flop over
- Patent number 9,837,305
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and fabrication method for enhanced mechanical strength c...
- Patent number 9,824,982
- Issue date Nov 21, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metallization using solid diffusion removal of metal...
- Patent number 9,793,206
- Issue date Oct 17, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Matching a spent firearm cartridge
- Patent number 9,778,007
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- F42 - AMMUNITION BLASTING
Information Patent Grant
Security key system
- Patent number 9,760,817
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20210335706
- Publication date Oct 28, 2021
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20200388568
- Publication date Dec 10, 2020
- Tessera, Inc.
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRU...
- Publication number 20200075406
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Benjamin David BRIGGS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Including a Porous Dielectric Layer, and Metho...
- Publication number 20190279931
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Benjamin David BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RIGIDITY MECHANISM
- Publication number 20180361225
- Publication date Dec 20, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE, SYSTEM, METHOD, AND RECORDING MEDIUM OF IMPLEMENTING A D...
- Publication number 20180354291
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Application
ENHANCED SELF-ALIGNMENT OF VIAS FOR A SEMICONDUCTOR DEVICE
- Publication number 20180254242
- Publication date Sep 6, 2018
- International Business Machines Corporation
- Benjamin D. BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20180190585
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Benjamin David BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP-VIAS BYPASSING A METALLIZATION LEVEL AT MINIMUM PITCH
- Publication number 20180114752
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METALLIZATION USING SOLID DIFFUSION REMOVAL OF METAL...
- Publication number 20180090372
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED AIRGAPS WITH CONDUCTIVE LINES AND VIAS
- Publication number 20180082885
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FABRICATION METHOD FOR ENHANCED MECHANICAL STRENGTH C...
- Publication number 20180047676
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED AIRGAPS WITH CONDUCTIVE LINES AND VIAS
- Publication number 20180005868
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRU...
- Publication number 20180005883
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Benjamin David BRIGGS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20180005941
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Benjamin David BRIGGS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SELF-ALIGNMENT OF VIAS FOR A SEMICONDUCTOR DEVICE
- Publication number 20180005937
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RIGIDITY MECHANISM
- Publication number 20170361201
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HIGH-DENSITY MIM CAPACITORS
- Publication number 20170301749
- Publication date Oct 19, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY MIM CAPACITORS
- Publication number 20170288011
- Publication date Oct 5, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, SYSTEM, METHOD , AND RECORDING MEDIUM OF IMPLEMENTING A...
- Publication number 20170249506
- Publication date Aug 31, 2017
- International Business Machines Corporation
- Benjamin David Briggs
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Application
SECURITY KEY SYSTEM
- Publication number 20170221285
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SECURITY KEY SYSTEM
- Publication number 20170220915
- Publication date Aug 3, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Bartlet H. DeProspo

Person

Patents Grantslast 30 patents

Semiconductor device including a porous dielectric layer, and metho...

Semiconductor device including a porous dielectric layer, and metho...

Semiconductor device including a porous dielectric layer, and metho...

Dynamic rigidity mechanism

Self-aligned airgaps with conductive lines and vias

Location-specific laser annealing to improve interconnect microstru...

Structure of implementing a directed self-assembled security pattern

Semiconductor device including a porous dielectric layer, and metho...

Location-specific laser annealing to improve interconnect microstru...

Enhanced self-alignment of vias for a semiconductor device

Semiconductor device including a porous dielectric layer, and metho...

Location-specific laser annealing to improve interconnect microstru...

Structure, system, method, and recording medium of implementing a d...

High-density MIM capacitors

Enhanced self-alignment of vias for asemiconductor device

Structure, system, method, and recording medium of implementing a d...

Semiconductor device including a porous dielectric layer, and metho...

Dynamic rigidity mechanism

Skip-vias bypassing a metallization level at minimum pitch

Semiconductor device including a porous dielectric layer, and metho...

Skip-vias bypassing a metallization level at minimum pitch

Self-aligned airgaps with conductive lines and vias

Structure and fabrication method for enhanced mechanical strength c...

Security key system

High-density MIM capacitors

Forming deep airgaps without flop over

Structure and fabrication method for enhanced mechanical strength c...

Heterogeneous metallization using solid diffusion removal of metal...

Matching a spent firearm cartridge

Security key system

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRU...

Semiconductor Device Including a Porous Dielectric Layer, and Metho...

DYNAMIC RIGIDITY MECHANISM

STRUCTURE, SYSTEM, METHOD, AND RECORDING MEDIUM OF IMPLEMENTING A D...

ENHANCED SELF-ALIGNMENT OF VIAS FOR A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SKIP-VIAS BYPASSING A METALLIZATION LEVEL AT MINIMUM PITCH

HETEROGENEOUS METALLIZATION USING SOLID DIFFUSION REMOVAL OF METAL...

SELF-ALIGNED AIRGAPS WITH CONDUCTIVE LINES AND VIAS

STRUCTURE AND FABRICATION METHOD FOR ENHANCED MECHANICAL STRENGTH C...

SELF-ALIGNED AIRGAPS WITH CONDUCTIVE LINES AND VIAS

LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRU...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

ENHANCED SELF-ALIGNMENT OF VIAS FOR A SEMICONDUCTOR DEVICE

DYNAMIC RIGIDITY MECHANISM

HIGH-DENSITY MIM CAPACITORS

HIGH-DENSITY MIM CAPACITORS

STRUCTURE, SYSTEM, METHOD , AND RECORDING MEDIUM OF IMPLEMENTING A...

SECURITY KEY SYSTEM

SECURITY KEY SYSTEM