Bassam Abdel-Dayem

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with capacitance die
- Patent number 12,132,028
- Issue date Oct 29, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stiffener ring having elevated opening
- Patent number 12,033,960
- Issue date Jul 9, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple interposers on a single substrate
- Patent number 11,923,347
- Issue date Mar 5, 2024
- Amazon Technologies, Inc.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH CAPACITANCE DIE
- Publication number 20230299045
- Publication date Sep 21, 2023
- AMAZON TECHNOLOGIES, INC.
- Bassam Abdel-Dayem
- H01 - BASIC ELECTRIC ELEMENTS