Bassam M. Ziadeh

Person

Laveen, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,741,419
- Issue date Aug 11, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick and place tooling with adjustable nozzle configuration
- Patent number 10,681,851
- Issue date Jun 9, 2020
- Intel Corporation
- Bassam Mohammed Ziadeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,580,758
- Issue date Mar 3, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling systems
- Patent number 10,529,600
- Issue date Jan 7, 2020
- Intel Corporation
- Bassam M. Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor die, method for making a die packaging...
- Patent number 10,483,177
- Issue date Nov 19, 2019
- Intel Corporation
- Bassam Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,403,512
- Issue date Sep 3, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Containers for holding and dispensing stacks of electronic device c...
- Patent number 10,214,340
- Issue date Feb 26, 2019
- Intel Corporation
- Mingjie Xu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 10,037,976
- Issue date Jul 31, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly that includes stacked dice
- Patent number 9,991,243
- Issue date Jun 5, 2018
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 9,899,238
- Issue date Feb 20, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable package architecture and associated techniques and configu...
- Patent number 9,793,244
- Issue date Oct 17, 2017
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to form high density through-mold interconnections
- Patent number 9,741,692
- Issue date Aug 22, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly that includes stacked dice
- Patent number 9,576,942
- Issue date Feb 21, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED DIE SHIPPING TRAY ASSEMBLY
- Publication number 20230290661
- Publication date Sep 14, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20220230892
- Publication date Jul 21, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20220196937
- Publication date Jun 23, 2022
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...
- Publication number 20210233867
- Publication date Jul 29, 2021
- Intel Corporation
- Bassam ZIADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT TRAYS FOR TRANSPORTING INTEGRATED CIRCUIT DICE
- Publication number 20200395234
- Publication date Dec 17, 2020
- Intel Corporation
- Bassam Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20200350181
- Publication date Nov 5, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20190341271
- Publication date Nov 7, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for a semiconductor die, method for making a die packaging...
- Publication number 20190006251
- Publication date Jan 3, 2019
- Intel Corporation
- Bassam Ziadeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PICK AND PLACE TOOLING WITH ADJUSTABLE NOZZLE CONFIGURATION
- Publication number 20180376631
- Publication date Dec 27, 2018
- Intel Corporation
- Bassam Mohammed ZIADEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180331075
- Publication date Nov 15, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING SYSTEMS AND METHODS FOR SAME
- Publication number 20180286832
- Publication date Oct 4, 2018
- Intel Corporation
- Bassam M. Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20180190510
- Publication date Jul 5, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAINERS FOR HOLDING AND DISPENSING STACKS OF ELECTRONIC DEVICE C...
- Publication number 20180002101
- Publication date Jan 4, 2018
- Intel Corporation
- Mingjie Xu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
MINIMAL CONTACT END-EFFECTORS FOR HANDLING MICROELECTRONIC DEVICES
- Publication number 20180005863
- Publication date Jan 4, 2018
- Intel Corporation
- DANIEL CHAVEZ-CLEMENTE
- G01 - MEASURING TESTING
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20180005997
- Publication date Jan 4, 2018
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY THAT INCLUDES STACKED DICE
- Publication number 20170323874
- Publication date Nov 9, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FORM HIGH DENSITY THROUGH-MOLD INTERCONNECTIONS
- Publication number 20160268231
- Publication date Sep 15, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...
- Publication number 20160260690
- Publication date Sep 8, 2016
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20160181218
- Publication date Jun 23, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Bassam M. Ziadeh

Person

Patents Grantslast 30 patents

Low cost package warpage solution

Hydrophobic feature to control adhesive flow

Low cost package warpage solution

Low cost package warpage solution

Low cost package warpage solution

Pick and place tooling with adjustable nozzle configuration

Scalable package architecture and associated techniques and configu...

Decoupling systems

Package for a semiconductor die, method for making a die packaging...

Low cost package warpage solution

Containers for holding and dispensing stacks of electronic device c...

Scalable package architecture and associated techniques and configu...

Integrated circuit assembly that includes stacked dice

Low cost package warpage solution

Scalable package architecture and associated techniques and configu...

Methods to form high density through-mold interconnections

Integrated circuit assembly that includes stacked dice

Patents Applicationslast 30 patents

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

LOW COST PACKAGE WARPAGE SOLUTION

SINGULATED DIE SHIPPING TRAY ASSEMBLY

LOW COST PACKAGE WARPAGE SOLUTION

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...

MULTI-COMPONENT TRAYS FOR TRANSPORTING INTEGRATED CIRCUIT DICE

LOW COST PACKAGE WARPAGE SOLUTION

LOW COST PACKAGE WARPAGE SOLUTION

Package for a semiconductor die, method for making a die packaging...

PICK AND PLACE TOOLING WITH ADJUSTABLE NOZZLE CONFIGURATION

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

DECOUPLING SYSTEMS AND METHODS FOR SAME

LOW COST PACKAGE WARPAGE SOLUTION

CONTAINERS FOR HOLDING AND DISPENSING STACKS OF ELECTRONIC DEVICE C...

MINIMAL CONTACT END-EFFECTORS FOR HANDLING MICROELECTRONIC DEVICES

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

INTEGRATED CIRCUIT ASSEMBLY THAT INCLUDES STACKED DICE

METHODS TO FORM HIGH DENSITY THROUGH-MOLD INTERCONNECTIONS

SCALABLE PACKAGE ARCHITECTURE AND ASSOCIATED TECHNIQUES AND CONFIGU...

LOW COST PACKAGE WARPAGE SOLUTION