Bau-Ming Wang

Person

HSINCHU CITY 300, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a doped fin well
- Patent number 12,211,901
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate spacers with stepped sidewalls by remo...
- Patent number 12,087,841
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with implantation of impur...
- Patent number 11,450,743
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin semiconductor device having a stepped gate spacer sidewall
- Patent number 11,374,108
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a protective stack on a semiconductor fin
- Patent number 10,741,667
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor manufacturing process
- Patent number 8,906,778
- Issue date Dec 9, 2014
- National Chiao Tung University
- YewChung Sermon Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION
- Publication number 20250022712
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Stop Region for Semiconductor Device Substrate Thinning
- Publication number 20240079239
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240006247
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bau-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED WELL FOR SEMICONDUCTOR DEVICES
- Publication number 20220406774
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Device with Implantation of Impur...
- Publication number 20220352321
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220352345
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Implantation for Semiconductor Device
- Publication number 20220123111
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bau-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE TO REDUCE EPITAXIAL DEFECTS DUE TO CONTACT STRESS...
- Publication number 20220059394
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Sih-Jie LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200373405
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190267465
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS
- Publication number 20120231614
- Publication date Sep 13, 2012
- NATIONAL CHIAO-TUNG UNIVERSITY
- YewChung Sermon Wu
- H01 - BASIC ELECTRIC ELEMENTS

Bau-Ming Wang

Person

Patents Grantslast 30 patents

Semiconductor device having a doped fin well

Method of manufacturing gate spacers with stepped sidewalls by remo...

Method of forming a semiconductor device with implantation of impur...

Fin semiconductor device having a stepped gate spacer sidewall

Method of manufacturing a protective stack on a semiconductor fin

Method of semiconductor manufacturing process

Patents Applicationslast 30 patents

HOT ION IMPLANTATION FOR CONDENSATION DEFECT REDUCTION

Etch Stop Region for Semiconductor Device Substrate Thinning

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

DOPED WELL FOR SEMICONDUCTOR DEVICES

Method of Forming a Semiconductor Device with Implantation of Impur...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of Implantation for Semiconductor Device

METHOD AND DEVICE TO REDUCE EPITAXIAL DEFECTS DUE TO CONTACT STRESS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF SEMICONDUCTOR MANUFACTURING PROCESS