Bau-Nan Lee

Follow

Person

Pingtung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package with electrical interconnection
- Patent number 6,927,480
- Issue date Aug 9, 2005
- Advanced Semiconductor Engineering, Inc.
- Bau-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-chip package with electrical interconnection
- Publication number 20040222503
- Publication date Nov 11, 2004
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Bau-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS