Bau-Ru Lu

Person

Changhua County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module
- Patent number 11,744,009
- Issue date Aug 29, 2023
- Cyntec Co., Ltd.
- Kaipeng Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 11,153,973
- Issue date Oct 19, 2021
- Cyntec Co., Ltd.
- Kaipeng Chiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic module with a magnetic device
- Patent number 11,134,570
- Issue date Sep 28, 2021
- Cyntec Co., Ltd.
- Chun Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 11,031,255
- Issue date Jun 8, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic structure
- Patent number 11,024,702
- Issue date Jun 1, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 11,017,934
- Issue date May 25, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) package structure having an epoxy molding co...
- Patent number 10,854,575
- Issue date Dec 1, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to form a stacked electronic structure
- Patent number 10,741,531
- Issue date Aug 11, 2020
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,636,735
- Issue date Apr 28, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 10,593,561
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic device mounted on a redistribution layer
- Patent number 10,529,680
- Issue date Jan 7, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and the fabrication method thereof
- Patent number 10,433,424
- Issue date Oct 1, 2019
- Cyntec Co., Ltd.
- Chun-Tiao Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,373,894
- Issue date Aug 6, 2019
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to fabricate thereof
- Patent number 10,373,930
- Issue date Aug 6, 2019
- Cyntec Co., Ltd.
- Jeng-Jen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure and the method to fabricate the...
- Patent number 10,297,573
- Issue date May 21, 2019
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with a magnetic device
- Patent number 10,212,817
- Issue date Feb 19, 2019
- Cyntec Co., Ltd.
- Chun Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic structure
- Patent number 10,199,361
- Issue date Feb 5, 2019
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and the method to fabricate thereof
- Patent number 10,128,214
- Issue date Nov 13, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for forming package
- Patent number 10,063,098
- Issue date Aug 28, 2018
- Cyntec Co., Ltd.
- Huei-Ren You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic structure
- Patent number 10,034,379
- Issue date Jul 24, 2018
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) package structure with electronic components...
- Patent number 9,984,996
- Issue date May 29, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,978,611
- Issue date May 22, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure and the method to fabricate the...
- Patent number 9,911,715
- Issue date Mar 6, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and the method to fabricate thereof
- Patent number 9,859,250
- Issue date Jan 2, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive component and package structure thereof
- Patent number 9,799,722
- Issue date Oct 24, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,741,590
- Issue date Aug 22, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure comprising a magnetic body and an indu...
- Patent number 9,734,944
- Issue date Aug 15, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having surface-mount pads on a lateral surface for c...
- Patent number 9,668,359
- Issue date May 30, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication of encapsulated electronics devices mounted o...
- Patent number 9,655,253
- Issue date May 16, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure
- Patent number 9,538,660
- Issue date Jan 3, 2017
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SUPPLY SYSTEM
- Publication number 20250224788
- Publication date Jul 10, 2025
- CYNTEC CO., LTD.
- Bau-Ru Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SUPPLY MODULE
- Publication number 20250227845
- Publication date Jul 10, 2025
- CYNTEC CO., LTD.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC STRUCTURE
- Publication number 20250125319
- Publication date Apr 17, 2025
- CYNTEC CO., LTD.
- Bau Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20220007502
- Publication date Jan 6, 2022
- CYNTEC CO., LTD.
- KAIPENG CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module
- Publication number 20210105898
- Publication date Apr 8, 2021
- CYNTEC CO., LTD.
- KAIPENG CHIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Stacked Electronic Structure
- Publication number 20200286980
- Publication date Sep 10, 2020
- CYNTEC CO., LTD.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Stack Frame for Electrical Connections and the Method to Fabricat...
- Publication number 20200176270
- Publication date Jun 4, 2020
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module with a Magnetic Device
- Publication number 20190150285
- Publication date May 16, 2019
- CYNTEC CO., LTD.
- Chun Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Form a Stacked Electronic Structure
- Publication number 20190131286
- Publication date May 2, 2019
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Electronic Structure
- Publication number 20180308829
- Publication date Oct 25, 2018
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional Package Structure and the Method to Fabricate The...
- Publication number 20180240781
- Publication date Aug 23, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20180233380
- Publication date Aug 16, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20180168045
- Publication date Jun 14, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module
- Publication number 20180166200
- Publication date Jun 14, 2018
- CYNTEC CO., LTD.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Package Structure and the Method to Fabricate The...
- Publication number 20180145050
- Publication date May 24, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and the Method to Fabricate Thereof
- Publication number 20180082979
- Publication date Mar 22, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20170316954
- Publication date Nov 2, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE WITH A MAGNETIC DEVCIE
- Publication number 20170223835
- Publication date Aug 3, 2017
- CYNTEC CO., LTD.
- Chun Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED ELECTRONIC DEVICE MOUNTED ON A REDISTRIBUTION LAYER
- Publication number 20170221849
- Publication date Aug 3, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC STRUCTURE
- Publication number 20170223834
- Publication date Aug 3, 2017
- CYNTEC CO., LTD.
- CHI-FENG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND METHOD FOR FORMING PACKAGE
- Publication number 20170201125
- Publication date Jul 13, 2017
- CYNTEC CO., LTD.
- HUEI-REN YOU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20170047273
- Publication date Feb 16, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20170047229
- Publication date Feb 16, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE HAVING SURFACE-MOUNT PADS ON A LATERAL SURFACE FOR C...
- Publication number 20160227649
- Publication date Aug 4, 2016
- CYNTEC CO., LTD.
- BAU-RU LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic module and the fabrication method thereof
- Publication number 20160113117
- Publication date Apr 21, 2016
- CYNTEC CO., LTD.
- Chun-Tiao Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20150348801
- Publication date Dec 3, 2015
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THE...
- Publication number 20150181733
- Publication date Jun 25, 2015
- CYNTEC CO., LTD.
- BAU-RU LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THE...
- Publication number 20150179611
- Publication date Jun 25, 2015
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND THE METHOD TO FABRICATE THEREOF
- Publication number 20150181766
- Publication date Jun 25, 2015
- CYNTEC CO., LTD.
- BAU-RU LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20150116960
- Publication date Apr 30, 2015
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Electronic module

Electronic module

Electronic module with a magnetic device

Stack frame for electrical connections and the method to fabricate...

Stacked electronic structure

Electronic module

Three-dimensional (3D) package structure having an epoxy molding co...

Method to form a stacked electronic structure

Package structure and the method to fabricate thereof

Stack frame for electrical connections and the method to fabricate...

Encapsulated electronic device mounted on a redistribution layer

Electronic module and the fabrication method thereof

Package structure and the method to fabricate thereof

Package structure and the method to fabricate thereof

Three-dimensional package structure and the method to fabricate the...

Electronic module with a magnetic device

Stacked electronic structure

Substrate and the method to fabricate thereof

Electronic module and method for forming package

Stacked electronic structure

Three-dimensional (3D) package structure with electronic components...

Stack frame for electrical connections and the method to fabricate...

Three-dimensional package structure and the method to fabricate the...

Substrate and the method to fabricate thereof

Inductive component and package structure thereof

Stack frame for electrical connections and the method to fabricate...

Electronic package structure comprising a magnetic body and an indu...

Circuit module having surface-mount pads on a lateral surface for c...

Method of fabrication of encapsulated electronics devices mounted o...

Electronic package structure

Patents Applicationslast 30 patents

POWER SUPPLY SYSTEM

POWER SUPPLY MODULE

STACKED ELECTRONIC STRUCTURE

Electronic Module

Electronic Module

Stacked Electronic Structure

A Stack Frame for Electrical Connections and the Method to Fabricat...

Electronic Module with a Magnetic Device

Method to Form a Stacked Electronic Structure

Stacked Electronic Structure

Three-Dimensional Package Structure and the Method to Fabricate The...

Stack Frame for Electrical Connections and the Method to Fabricate...

Electronic Module

Electronic Module

Three-Dimensional Package Structure and the Method to Fabricate The...

Substrate and the Method to Fabricate Thereof

Stack Frame for Electrical Connections and the Method to Fabricate...

ELECTRONIC MODULE WITH A MAGNETIC DEVCIE

ENCAPSULATED ELECTRONIC DEVICE MOUNTED ON A REDISTRIBUTION LAYER

STACKED ELECTRONIC STRUCTURE

ELECTRONIC MODULE AND METHOD FOR FORMING PACKAGE

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

CIRCUIT MODULE HAVING SURFACE-MOUNT PADS ON A LATERAL SURFACE FOR C...

Electronic module and the fabrication method thereof

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THE...

THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THE...

SUBSTRATE AND THE METHOD TO FABRICATE THEREOF

ELECTRONIC PACKAGE STRUCTURE