Membership
Tour
Register
Log in
Baw-Ching Perng
Follow
Person
Baoshan Township, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
Patent number
11,676,938
Issue date
Jun 13, 2023
JCET Semiconductor (Shaoxing) Co., Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
Patent number
9,673,093
Issue date
Jun 6, 2017
STATS ChipPAC Pte. Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
9,093,450
Issue date
Jul 28, 2015
Xintec Inc.
Baw-Ching Perng
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Power MOSFET package
Patent number
8,766,431
Issue date
Jul 1, 2014
Baw-Ching Perng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
8,610,271
Issue date
Dec 17, 2013
Baw-Ching Perng
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip package and method for forming the same
Patent number
8,564,133
Issue date
Oct 22, 2013
Ying-Nan Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power MOSFET package
Patent number
8,410,599
Issue date
Apr 2, 2013
Baw-Ching Perng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Making Wafer Level Chip Scale Pa...
Publication number
20170236802
Publication date
Aug 17, 2017
STATS ChipPAC Pte Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making Wafer Level Chip Scale Pa...
Publication number
20150041985
Publication date
Feb 12, 2015
STATS ChipPAC, Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20140073089
Publication date
Mar 13, 2014
Xintec Inc.
Baw-Ching PERNG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
POWER MOSFET PACKAGE
Publication number
20130193520
Publication date
Aug 1, 2013
Xintec Inc.
Baw-Ching PERNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20110127670
Publication date
Jun 2, 2011
Baw-Ching PERNG
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20110042819
Publication date
Feb 24, 2011
Ying-Nan WEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MOSFET PACKAGE
Publication number
20100289092
Publication date
Nov 18, 2010
Baw-Ching PERNG
H01 - BASIC ELECTRIC ELEMENTS