Bee Ngoh Kee

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Packaging of integrated circuits to lead frames
- Patent number 7,645,639
- Issue date Jan 12, 2010
- Infineon Technologies AG
- Tian Siang Yip
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging of Intergrated Circuits to Lead Frames
- Publication number 20070252248
- Publication date Nov 1, 2007
- Tian Siang Yip
- H01 - BASIC ELECTRIC ELEMENTS