Benben Li

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-decks memory device including inter-deck switches
- Patent number 11,763,889
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Benben Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 11,569,258
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-decks memory device including inter-deck switches
- Patent number 11,289,163
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-decks memory device including inter-deck switches
- Patent number 10,825,523
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 10,748,921
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-decks memory device including inter-deck switches
- Patent number 10,475,515
- Issue date Nov 12, 2019
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked thin channels for boost and leakage improvement
- Patent number 9,412,821
- Issue date Aug 9, 2016
- Intel Corporation
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked thin channels for boost and leakage improvement
- Patent number 9,209,199
- Issue date Dec 8, 2015
- Intel Corporation
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES
- Publication number 20220284959
- Publication date Sep 8, 2022
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES
- Publication number 20210118508
- Publication date Apr 22, 2021
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20200350333
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20200135751
- Publication date Apr 30, 2020
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES
- Publication number 20200066346
- Publication date Feb 27, 2020
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES
- Publication number 20190198109
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Benben Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED THIN CHANNELS FOR BOOST AND LEAKAGE IMPROVEMENT
- Publication number 20160126311
- Publication date May 5, 2016
- Intel Corporation
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED THIN CHANNELS FOR BOOST AND LEAKAGE IMPROVEMENT
- Publication number 20150270280
- Publication date Sep 24, 2015
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multi-decks memory device including inter-deck switches

Integrated assemblies which include stacked memory decks, and metho...

Multi-decks memory device including inter-deck switches

Multi-decks memory device including inter-deck switches

Integrated assemblies which include stacked memory decks, and metho...

Multi-decks memory device including inter-deck switches

Stacked thin channels for boost and leakage improvement

Stacked thin channels for boost and leakage improvement

Patents Applicationslast 30 patents

MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES

MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES

MULTI-DECKS MEMORY DEVICE INCLUDING INTER-DECK SWITCHES

STACKED THIN CHANNELS FOR BOOST AND LEAKAGE IMPROVEMENT

STACKED THIN CHANNELS FOR BOOST AND LEAKAGE IMPROVEMENT