Benedict W. Pang

Follow

Person

Burlingame, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlling chemical mechanical polishing pad stiffness by adjustin...
- Patent number 12,257,664
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Face-up wafer electrochemical planarization apparatus
- Patent number 12,090,600
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20230390887
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
FACE-UP WAFER EDGE POLISHING APPARATUS
- Publication number 20230024009
- Publication date Jan 26, 2023
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
Controlling Chemical Mechanical Polishing Pad Stiffness By Adjustin...
- Publication number 20200276685
- Publication date Sep 3, 2020
- Kevin H. Song
- B24 - GRINDING POLISHING