Benfu LIN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Programmable interposer using RRAM platform
- Patent number 12,284,924
- Issue date Apr 22, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
Information Patent Grant
Integrated thin film resistor and memory device
- Patent number 11,742,283
- Issue date Aug 29, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming semiconductor devices...
- Patent number 11,744,085
- Issue date Aug 29, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory cells and methods for forming memory cells
- Patent number 11,641,789
- Issue date May 2, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structures of passive semiconductor devices
- Patent number 11,610,837
- Issue date Mar 21, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods of forming memory devices
- Patent number 11,600,664
- Issue date Mar 7, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lanxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory device and methods of making such a resistive memo...
- Patent number 11,522,131
- Issue date Dec 6, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Curtis Chun-I Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistors of semiconductor devices
- Patent number 11,335,635
- Issue date May 17, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods of forming integrated circuits
- Patent number 11,164,858
- Issue date Nov 2, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MTJ bottom metal via in a memory cell and method for producing the...
- Patent number 10,693,054
- Issue date Jun 23, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mram memory device and manufacturing method thereof
- Patent number 9,997,562
- Issue date Jun 12, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with optical modulators and photodetectors and...
- Patent number 9,711,662
- Issue date Jul 18, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shunqiang Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar passivation for pads
- Patent number 9,520,371
- Issue date Dec 13, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP head structure with retaining ring
- Patent number 9,511,470
- Issue date Dec 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
CMP head structure with retaining ring
- Patent number 9,511,474
- Issue date Dec 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Through silicon vias
- Patent number 9,437,547
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias
- Patent number 9,287,197
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP head structure
- Patent number 9,242,341
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
CMP head structure
- Patent number 9,242,338
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PROGRAMMABLE INTERPOSER USING RRAM PLATFORM
- Publication number 20230301214
- Publication date Sep 21, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San LEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELLS AND METHODS FOR FORMING MEMORY CELLS
- Publication number 20220416160
- Publication date Dec 29, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Yi JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THIN FILM RESISTOR AND MEMORY DEVICE
- Publication number 20220208675
- Publication date Jun 30, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee GAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES
- Publication number 20220093508
- Publication date Mar 24, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XUESONG RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20220077234
- Publication date Mar 10, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- G11 - INFORMATION STORAGE
Information Patent Application
RESISTIVE MEMORY DEVICE AND METHODS OF MAKING SUCH A RESISTIVE MEMO...
- Publication number 20220037590
- Publication date Feb 3, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Curtis Chun-I Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTORS OF SEMICONDUCTOR DEVICES
- Publication number 20210320063
- Publication date Oct 14, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- BENFU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS
- Publication number 20210288042
- Publication date Sep 16, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS OF FORMING MEMORY DEVICES
- Publication number 20210225936
- Publication date Jul 22, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lanxiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH MAGNETIC TUNNEL JUNCTION MEMORY CELLS AND...
- Publication number 20210028349
- Publication date Jan 28, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MTJ BOTTOM METAL VIA IN A MEMORY CELL AND METHOD FOR PRODUCING THE...
- Publication number 20200035906
- Publication date Jan 30, 2020
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Danny Pak-Chum SHUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ALIGNMENT MARK USING A PLANARIZATION PROCESS
- Publication number 20180233661
- Publication date Aug 16, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS
- Publication number 20160190066
- Publication date Jun 30, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20160136781
- Publication date May 19, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20160136774
- Publication date May 19, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
PLANAR PASSIVATION FOR PADS
- Publication number 20160118355
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20150111467
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20150111469
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
THROUGH SILICON VIAS
- Publication number 20140264911
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC FILTRATION FOR CMP SLURRY
- Publication number 20100206818
- Publication date Aug 19, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Lup San Leong
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Person

Patents Grantslast 30 patents

Programmable interposer using RRAM platform

Integrated thin film resistor and memory device

Semiconductor devices and methods of forming semiconductor devices...

Memory cells and methods for forming memory cells

Via structures of passive semiconductor devices

Memory devices and methods of forming memory devices

Resistive memory device and methods of making such a resistive memo...

Thin film resistors of semiconductor devices

Integrated circuits and methods of forming integrated circuits

MTJ bottom metal via in a memory cell and method for producing the...

Mram memory device and manufacturing method thereof

Integrated circuits with optical modulators and photodetectors and...

Planar passivation for pads

CMP head structure with retaining ring

CMP head structure with retaining ring

Through silicon vias

Through silicon vias

CMP head structure

CMP head structure

Patents Applicationslast 30 patents

PROGRAMMABLE INTERPOSER USING RRAM PLATFORM

MEMORY CELLS AND METHODS FOR FORMING MEMORY CELLS

INTEGRATED THIN FILM RESISTOR AND MEMORY DEVICE

VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES

RESISTIVE MEMORY DEVICE AND METHODS OF MAKING SUCH A RESISTIVE MEMO...

THIN FILM RESISTORS OF SEMICONDUCTOR DEVICES

INTEGRATED CIRCUITS AND METHODS OF FORMING INTEGRATED CIRCUITS

MEMORY DEVICES AND METHODS OF FORMING MEMORY DEVICES

INTEGRATED CIRCUITS WITH MAGNETIC TUNNEL JUNCTION MEMORY CELLS AND...

MTJ BOTTOM METAL VIA IN A MEMORY CELL AND METHOD FOR PRODUCING THE...

DEVICE ALIGNMENT MARK USING A PLANARIZATION PROCESS

THROUGH SILICON VIAS

CMP HEAD STRUCTURE

CMP HEAD STRUCTURE

PLANAR PASSIVATION FOR PADS

CMP HEAD STRUCTURE

CMP HEAD STRUCTURE

THROUGH SILICON VIAS

ULTRASONIC FILTRATION FOR CMP SLURRY