Beng Yeung HO

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,354,934
- Issue date Jul 16, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,978,658
- Issue date May 22, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for singulating semiconductor wafer
- Patent number 9,741,619
- Issue date Aug 22, 2017
- UTAC HEADQUARTERS PTE. LTD.
- William John Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for singulating semiconductor wafer
- Patent number 9,570,314
- Issue date Feb 14, 2017
- UTAC HEADQUARTERS PTE. LTD.
- William John Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,508,623
- Issue date Nov 29, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer arrangement and a wafer level package comprising the layer ar...
- Patent number 9,240,362
- Issue date Jan 19, 2016
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20180240726
- Publication date Aug 23, 2018
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
- Publication number 20170117185
- Publication date Apr 27, 2017
- UTAC Headquarters Pte. Ltd.
- William John NELSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170077007
- Publication date Mar 16, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SINGULATING SEMICONDUCTOR WAFER
- Publication number 20160104626
- Publication date Apr 14, 2016
- UTAC Headquarters Pte. Ltd.
- William John NELSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150357256
- Publication date Dec 10, 2015
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER AR...
- Publication number 20150130039
- Publication date May 14, 2015
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Beng Yeung HO

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Methods for singulating semiconductor wafer

Methods for singulating semiconductor wafer

Semiconductor packages and methods of packaging semiconductor devices

Layer arrangement and a wafer level package comprising the layer ar...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

METHODS FOR SINGULATING SEMICONDUCTOR WAFER

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

METHODS FOR SINGULATING SEMICONDUCTOR WAFER

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER AR...