Bengt Ahl

Person

Gavle, SE

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple ground signal path LDMOS power package
- Patent number 6,777,791
- Issue date Aug 17, 2004
- Infineon Technologies AG
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stability enhanced multistage power amplifier
- Patent number 6,583,673
- Issue date Jun 24, 2003
- Infineon Technologies AG
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor module, power amplifier and methods in the fabrica...
- Patent number 6,580,316
- Issue date Jun 17, 2003
- Telefonaktiebolaget LM Ericsson (publ)
- Lars-Anders Olofsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power transistor module, power amplifier and method in the fabricat...
- Patent number 6,501,159
- Issue date Dec 31, 2002
- Telefonaktiebolaget L M Ericsson
- Lars-Anders Olofsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional lid for RF power package
- Patent number 6,392,298
- Issue date May 21, 2002
- Ericsson Inc.
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive mounting arrangement for securing an integrate...
- Patent number 6,181,006
- Issue date Jan 30, 2001
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive mounting arrangement for securing an integrated circuit...
- Patent number 6,160,710
- Issue date Dec 12, 2000
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond attachment of a integrated circuit package to a heat sink
- Patent number 5,933,327
- Issue date Aug 3, 1999
- Ericsson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting arrangement for securing an intergrated circuit package to...
- Patent number 5,869,897
- Issue date Feb 9, 1999
- Ericcson, Inc.
- Larry C. Leighton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multiple ground signal path LDMOS power package
- Publication number 20020140071
- Publication date Oct 3, 2002
- Larry Leighton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stability enhanced multistage power amplifier
- Publication number 20020118068
- Publication date Aug 29, 2002
- Ericsson Inc.
- Bengt Ahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power transistor module, power amplifier and methods in the fabrica...
- Publication number 20010038310
- Publication date Nov 8, 2001
- Lars-Anders Olofsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power transistor module, power amplifier and method in the fabricat...
- Publication number 20010004115
- Publication date Jun 21, 2001
- Lars-Anders Olofsson
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multiple ground signal path LDMOS power package

Stability enhanced multistage power amplifier

Power transistor module, power amplifier and methods in the fabrica...

Power transistor module, power amplifier and method in the fabricat...

Functional lid for RF power package

Thermally conductive mounting arrangement for securing an integrate...

Capacitive mounting arrangement for securing an integrated circuit...

Wire bond attachment of a integrated circuit package to a heat sink

Mounting arrangement for securing an intergrated circuit package to...

Patents Applicationslast 30 patents

Multiple ground signal path LDMOS power package

Stability enhanced multistage power amplifier

Power transistor module, power amplifier and methods in the fabrica...

Power transistor module, power amplifier and method in the fabricat...