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Benjamin A. Samples

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  • Bend, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lid cover spring design
    • Patent number 10,522,443
    • Issue date Dec 31, 2019
    • Microsemi Corporation
    • Benjamin A. Samples
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    RF package
    • Patent number 8,410,601
    • Issue date Apr 2, 2013
    • Microsemi Corporation
    • Benjamin A. Samples
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multi-layer thick-film RF package
    • Patent number 8,034,666
    • Issue date Oct 11, 2011
    • Microsemi Corporation
    • Benjamin A. Samples
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LID COVER SPRING DESIGN
    • Publication number 20180350716
    • Publication date Dec 6, 2018
    • MICROSEMI CORPORATION
    • Benjamin A. Samples
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RF PACKAGE
    • Publication number 20110116237
    • Publication date May 19, 2011
    • MICROSEMI CORPORATION
    • Benjamin A. Samples
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYER THICK-FILM RF PACKAGE
    • Publication number 20110117705
    • Publication date May 19, 2011
    • MICROSEMI CORPORATION
    • Benjamin A. Samples
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR