Benjamin Bernard

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Villach, AT

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices by filling grooves fo...
- Patent number 12,094,837
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thin semiconductor die
- Patent number 11,605,599
- Issue date Mar 14, 2023
- Infineon Technologies AG
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY FILLING GROOVES FO...
- Publication number 20230187381
- Publication date Jun 15, 2023
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SPLITTING A SEMICONDUCTOR WORK PIECE
- Publication number 20220339740
- Publication date Oct 27, 2022
- Benjamin Bernard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Having a Thin Semiconductor Die
- Publication number 20210143108
- Publication date May 13, 2021
- Christian Gruber
- H01 - BASIC ELECTRIC ELEMENTS