Benjamin L. McClain

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
- Patent number 11,670,612
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,962
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,963
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,998,208
- Issue date May 4, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stress reduction in semiconductor package via carrier
- Patent number 10,952,333
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 10,950,568
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for substrate moisture NCF voiding elimination
- Patent number 10,879,195
- Issue date Dec 29, 2020
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,210
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,209
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for inhibiting bonding materials from contamina...
- Patent number 10,700,038
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stress reduction in semiconductor package via carrier
- Patent number 10,548,230
- Issue date Jan 28, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,410,891
- Issue date Sep 10, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for 3D ink jet TCB interconnect control
- Patent number 10,276,539
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 10,090,177
- Issue date Oct 2, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230197669
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20210225672
- Publication date Jul 22, 2021
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20210193606
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20210183802
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Substrate Moisture NCF Voiding Elimination
- Publication number 20210111132
- Publication date Apr 15, 2021
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210091037
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210074671
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212000
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200211999
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Stress Reduction in Semiconductor Package via Carrier
- Publication number 20200113067
- Publication date Apr 9, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190326142
- Publication date Oct 24, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Substrate Moisture NCF Voiding Elimination
- Publication number 20190252330
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Stress Reduction in Semiconductor Package via Carrier
- Publication number 20190208647
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- Benjamin L. McClain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for 3D Ink Jet TCB Interconnect Control
- Publication number 20190131272
- Publication date May 2, 2019
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR INHIBITING BONDING MATERIALS FROM CONTAMINA...
- Publication number 20190067238
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...
- Publication number 20190067232
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- BRANDON P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...
- Publication number 20190067053
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Jeremy E. Minnich
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20180366434
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20180342476
- Publication date Nov 29, 2018
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS

Benjamin L. McClain

Person

Patents Grantslast 30 patents

Semiconductor device assembly with surface-mount die support struct...

Methods and systems for manufacturing semiconductor devices

Thermocompression bond tips and related apparatus and methods

Method for solder bridging elimination for bulk solder C2S intercon...

Cold fluid semiconductor device release during pick and place opera...

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Thermocompression bond tips and related apparatus and methods

Cold fluid semiconductor device release during pick and place opera...

Method for stress reduction in semiconductor package via carrier

Semiconductor device assembly with surface-mount die support struct...

Method for substrate moisture NCF voiding elimination

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Methods and systems for inhibiting bonding materials from contamina...

Method for stress reduction in semiconductor package via carrier

Cold fluid semiconductor device release during pick and place opera...

Method for 3D ink jet TCB interconnect control

Cold fluid semiconductor device release during pick and place opera...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

Method for Substrate Moisture NCF Voiding Elimination

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Method for Stress Reduction in Semiconductor Package via Carrier

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

Method for Substrate Moisture NCF Voiding Elimination

Method for Stress Reduction in Semiconductor Package via Carrier

Method for 3D Ink Jet TCB Interconnect Control

METHODS AND SYSTEMS FOR INHIBITING BONDING MATERIALS FROM CONTAMINA...

Method for Solder Bridging Elimination for Bulk Solder C2S Intercon...

COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERA...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...