Benjamin Naab

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Framingham, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electroless metallization of through-holes and vias of substrates w...
- Patent number 10,151,035
- Issue date Dec 11, 2018
- Rohm and Haas Electronic Materials LLC
- Benjamin Naab
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL-CLAD POLYMER FILMS AND ELECTRONIC DEVICES
- Publication number 20210310126
- Publication date Oct 7, 2021
- DUPONT ELECTRONICS, INC.
- Husnu Alp Alidedeoglu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED COPPER CONDUCTOR STRUCTURES AND MANUFACTURE THEREOF
- Publication number 20210249169
- Publication date Aug 12, 2021
- DUPONT ELECTRONICS, INC.
- Gregory Scott Blackman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION
- Publication number 20210140051
- Publication date May 13, 2021
- Rohm and Haas Electronic Materials L.L.C.
- Benjamin NAAB
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION
- Publication number 20210140052
- Publication date May 13, 2021
- Rohm and Haas Electronic Materials L.L.C.
- Benjamin NAAB
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS METALLIZATION OF THROUGH-HOLES AND VIAS OF SUBSTRATES W...
- Publication number 20170342567
- Publication date Nov 30, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Benjamin Naab
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...