Benjamin V. Fasano

Person

New Windsor, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered substrates of semiconductor devices
- Patent number 11,502,106
- Issue date Nov 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Benjamin Vito Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with ultra-low-K dielectric region between...
- Patent number 11,502,400
- Issue date Nov 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Selaka B. Bulumulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pluggable LGA socket for high density interconnects
- Patent number 11,146,003
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with ultra-low-K dielectric region between...
- Patent number 11,075,453
- Issue date Jul 27, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Selaka B. Bulumulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic die fan out package with edge fiber coupling interface and...
- Patent number 10,598,860
- Issue date Mar 24, 2020
- GLOBALFOUNDRIES Inc.
- Koushik Ramachandran
- G02 - OPTICS
Information Patent Grant
Interposer with lattice construction and embedded conductive metal...
- Patent number 10,460,956
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PIC die packaging using magnetics to position optical element
- Patent number 10,409,014
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Inc.
- Koushik Ramachandran
- G02 - OPTICS
Information Patent Grant
Pluggable LGA socket for high density interconnects
- Patent number 10,128,590
- Issue date Nov 13, 2018
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for establishing interconnects in packages using thin int...
- Patent number 10,002,835
- Issue date Jun 19, 2018
- GLOBALFOUNDRIES Inc.
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Validation of mechanical connections
- Patent number 9,947,204
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Alan F. Benner
- G08 - SIGNALLING
Information Patent Grant
Selectively soluble standoffs for chip joining
- Patent number 9,673,177
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with lattice construction and embedded conductive metal...
- Patent number 9,673,064
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for establishing interconnects in packages using thin interp...
- Patent number 9,607,973
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pluggable LGA socket for high density interconnects
- Patent number 9,577,361
- Issue date Feb 21, 2017
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with lattice construction and embedded conductive metal...
- Patent number 9,443,799
- Issue date Sep 13, 2016
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die and photonics die package
- Patent number 9,360,644
- Issue date Jun 7, 2016
- International Business Machines Corporation
- Benjamin V. Fasano
- G02 - OPTICS
Information Patent Grant
Electronic module assembly with patterned adhesive array
- Patent number 9,293,439
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill head interface with combination vacuum pressure chamber
- Patent number 9,278,401
- Issue date Mar 8, 2016
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module assembly with patterned adhesive array
- Patent number 9,093,563
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Validation of mechanical connections
- Patent number 8,981,961
- Issue date Mar 17, 2015
- International Business Machines Corporation
- Alan F. Benner
- G08 - SIGNALLING
Information Patent Grant
Maintaining laminate flatness using magnetic retention during chip...
- Patent number 8,940,550
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,559,474
- Issue date Oct 15, 2013
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,290,008
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Dispensing assembly with a controlled gas environment
- Patent number 8,123,088
- Issue date Feb 28, 2012
- International Business Machines Corporation
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dispensing assembly with an injector controlled gas environment
- Patent number 8,123,089
- Issue date Feb 28, 2012
- Internation Business Machines Corporation
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for implementing secure multichip modules for encryption...
- Patent number 7,806,341
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to recover underfilled modules by selective removal of discr...
- Patent number 7,781,232
- Issue date Aug 24, 2010
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device including reworkable alpha particle barrier and c...
- Patent number 7,615,850
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Rehan Choudhary
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and apparatus for forming stacked die and substrate structur...
- Patent number 7,611,923
- Issue date Nov 3, 2009
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to provide balanced mechanical loading of devi...
- Patent number 7,518,235
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE WITH ULTRA-LOW-K DIELECTRIC REGION BETWEEN...
- Publication number 20210273323
- Publication date Sep 2, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Selaka B. Bulumulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED SUBSTRATES OF SEMICONDUCTOR DEVICES
- Publication number 20210249442
- Publication date Aug 12, 2021
- GLOBALFOUNDRIES U.S. Inc.
- BENJAMIN VITO FASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR ALIGNING AND SECURING OPTICAL FIBERS IN...
- Publication number 20210173145
- Publication date Jun 10, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Benjamin V. Fasano
- G02 - OPTICS
Information Patent Application
PHOTONIC DIE FAN OUT PACKAGE WITH EDGE FIBER COUPLING INTERFACE AND...
- Publication number 20190285804
- Publication date Sep 19, 2019
- GLOBALFOUNDRIES INC.
- Koushik Ramachandran
- G02 - OPTICS
Information Patent Application
PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS
- Publication number 20180358725
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING
- Publication number 20170170148
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USI...
- Publication number 20170148737
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Benjamin V. FASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL...
- Publication number 20160372337
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DIE PACKAGING
- Publication number 20160266332
- Publication date Sep 15, 2016
- GLOBAL FOUNDRIES Inc.
- Benjamin Fasano
- G02 - OPTICS
Information Patent Application
INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL...
- Publication number 20160172288
- Publication date Jun 16, 2016
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL...
- Publication number 20160172290
- Publication date Jun 16, 2016
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VALIDATION OF MECHANICAL CONNECTIONS
- Publication number 20160163176
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Alan F. Benner
- G08 - SIGNALLING
Information Patent Application
PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS
- Publication number 20160118760
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS
- Publication number 20160118731
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIE AND PHOTONICS DIE PACKAGE
- Publication number 20160070061
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Benjamin V. Fasano
- G02 - OPTICS
Information Patent Application
ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY
- Publication number 20150093859
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES A...
- Publication number 20150033556
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module Assembly With Patterned Adhesive Array
- Publication number 20150014836
- Publication date Jan 15, 2015
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER
- Publication number 20140224860
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VALIDATION OF MECHANICAL CONNECTIONS
- Publication number 20140203945
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Alan F. Benner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES A...
- Publication number 20130233598
- Publication date Sep 12, 2013
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20120326290
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
MODULE ASSEMBLY HOLDING WORKBOARD
- Publication number 20120217986
- Publication date Aug 30, 2012
- International Business Machines Corporation
- Alan F. Benner
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20110044369
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
Dispensing Assembly with a Controlled Gas Environment
- Publication number 20100084437
- Publication date Apr 8, 2010
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dispensing Assembly with an Injector Controlled Gas Environment
- Publication number 20100084438
- Publication date Apr 8, 2010
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCR...
- Publication number 20090184407
- Publication date Jul 23, 2009
- International Business Machines Corporation
- Charles L. Arvin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...
- Publication number 20090145973
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND DEVICE INCLUDING REWORKABLE ALPHA PARTICLE BARRIER AND C...
- Publication number 20080217793
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Rehan CHOUDHARY
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20080000988
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING

Benjamin V. Fasano

Person

Patents Grantslast 30 patents

Multi-layered substrates of semiconductor devices

Microelectronics package with ultra-low-K dielectric region between...

Pluggable LGA socket for high density interconnects

Microelectronics package with ultra-low-K dielectric region between...

Photonic die fan out package with edge fiber coupling interface and...

Interposer with lattice construction and embedded conductive metal...

PIC die packaging using magnetics to position optical element

Pluggable LGA socket for high density interconnects

Structure for establishing interconnects in packages using thin int...

Validation of mechanical connections

Selectively soluble standoffs for chip joining

Interposer with lattice construction and embedded conductive metal...

Method for establishing interconnects in packages using thin interp...

Pluggable LGA socket for high density interconnects

Interposer with lattice construction and embedded conductive metal...

Laser die and photonics die package

Electronic module assembly with patterned adhesive array

Fill head interface with combination vacuum pressure chamber

Electronic module assembly with patterned adhesive array

Validation of mechanical connections

Maintaining laminate flatness using magnetic retention during chip...

Silicon carrier optoelectronic packaging

Silicon carrier optoelectronic packaging

Dispensing assembly with a controlled gas environment

Dispensing assembly with an injector controlled gas environment

Structure for implementing secure multichip modules for encryption...

Method to recover underfilled modules by selective removal of discr...

Method and device including reworkable alpha particle barrier and c...

Method and apparatus for forming stacked die and substrate structur...

Method and structure to provide balanced mechanical loading of devi...

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE WITH ULTRA-LOW-K DIELECTRIC REGION BETWEEN...

MULTI-LAYERED SUBSTRATES OF SEMICONDUCTOR DEVICES

STRUCTURES AND METHODS FOR ALIGNING AND SECURING OPTICAL FIBERS IN...

PHOTONIC DIE FAN OUT PACKAGE WITH EDGE FIBER COUPLING INTERFACE AND...

PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS

SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING

METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USI...

INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL...

OPTICAL DIE PACKAGING

INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL...

INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL...

VALIDATION OF MECHANICAL CONNECTIONS

PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS

PLUGGABLE LGA SOCKET FOR HIGH DENSITY INTERCONNECTS

LASER DIE AND PHOTONICS DIE PACKAGE

ELECTRONIC MODULE ASSEMBLY WITH PATTERNED ADHESIVE ARRAY

FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES A...

Electronic Module Assembly With Patterned Adhesive Array

FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER

VALIDATION OF MECHANICAL CONNECTIONS

FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES A...

SILICON CARRIER OPTOELECTRONIC PACKAGING

MODULE ASSEMBLY HOLDING WORKBOARD

SILICON CARRIER OPTOELECTRONIC PACKAGING

Dispensing Assembly with a Controlled Gas Environment

Dispensing Assembly with an Injector Controlled Gas Environment

METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCR...

STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...

METHOD AND DEVICE INCLUDING REWORKABLE ALPHA PARTICLE BARRIER AND C...

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...