Benjamin W. Mooring

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced automatic wafer centering system and techniques for same
- Patent number 11,581,214
- Issue date Feb 14, 2023
- Lam Research Corporation
- Peter S. Thaulad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced automatic wafer centering system and techniques for same
- Patent number 10,796,940
- Issue date Oct 6, 2020
- Lam Research Corporation
- Peter S. Thaulad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial-filtering automatic wafer centering process and associated...
- Patent number 10,790,237
- Issue date Sep 29, 2020
- Lam Research Corporation
- Benjamin W. Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform architecture to improve system productivity
- Patent number 10,559,483
- Issue date Feb 11, 2020
- Lam Research Corporation
- Richard H. Gould
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system related to semiconductor processing equipment
- Patent number 10,256,124
- Issue date Apr 9, 2019
- Lam Research Corporation
- Benjamin W. Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system related to semiconductor processing equipment
- Patent number 9,293,317
- Issue date Mar 22, 2016
- Lam Research Corporation
- Benjamin W. Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled ambient system for interface engineering
- Patent number 9,117,860
- Issue date Aug 25, 2015
- Lam Research Corporation
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer heating and temperature control by backside fluid injection
- Patent number 8,591,665
- Issue date Nov 26, 2013
- Lam Research Corporation
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer heating and temperature control by backside fluid injection
- Patent number 8,328,942
- Issue date Dec 11, 2012
- Lam Research Corporation
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic alignment of wafers using compensation values obtained thro...
- Patent number 8,185,242
- Issue date May 22, 2012
- Lam Research Corporation
- Scott Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset correction techniques for positioning substrates within a pr...
- Patent number 8,135,485
- Issue date Mar 13, 2012
- Lam Research Corporation
- Jack Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset correction methods and arrangement for positioning and inspe...
- Patent number 7,486,878
- Issue date Feb 3, 2009
- Lam Research Corporation
- Jack Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset correction techniques for positioning substrates
- Patent number 7,479,236
- Issue date Jan 20, 2009
- Lam Research Corporation
- Jack Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Methods and apparatus for determining an average electrical respons...
- Patent number 7,164,282
- Issue date Jan 16, 2007
- Lam Research Corporation
- Andrew D. Bailey, III
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining substrate offset using optimiz...
- Patent number 6,629,053
- Issue date Sep 30, 2003
- Lam Research Corporation
- Benjamin W. Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for dynamic alignment of substrates
- Patent number 6,502,054
- Issue date Dec 31, 2002
- Lam Research Corporation
- Benjamin W. Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chemical mechanical planarization and poli...
- Patent number 6,428,394
- Issue date Aug 6, 2002
- Lam Research Corporation
- Ben Mooring
- B24 - GRINDING POLISHING
Information Patent Grant
Modular architecture for semiconductor wafer fabrication equipment
- Patent number 6,312,525
- Issue date Nov 6, 2001
- Applied Materials, Inc.
- Nick Bright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing platform architecture having processing mo...
- Patent number 6,267,545
- Issue date Jul 31, 2001
- Lam Research Corporation
- Benjamin W. Mooring
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Dual sided slot valve and method for implementing the same
- Patent number 6,095,741
- Issue date Aug 1, 2000
- Lam Research Corporation
- Tony R. Kroeker
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Dual plane robot
- Patent number 5,789,878
- Issue date Aug 4, 1998
- Applied Materials, Inc.
- Tony Kroeker
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED AUTOMATIC WAFER CENTERING SYSTEM AND TECHNIQUES FOR SAME
- Publication number 20220028714
- Publication date Jan 27, 2022
- LAM RESEARCH CORPORATION
- Peter S. Thaulad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED AUTOMATIC WAFER CENTERING SYSTEM AND TECHNIQUES FOR SAME
- Publication number 20200144097
- Publication date May 7, 2020
- LAM RESEARCH CORPORATION
- Peter S. Thaulad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fiducial-Filtering Automatic Wafer Centering Process and Associated...
- Publication number 20200091085
- Publication date Mar 19, 2020
- LAM RESEARCH CORPORATION
- Benjamin W. Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATFORM ARCHITECTURE TO IMPROVE SYSTEM PRODUCTIVITY
- Publication number 20180047598
- Publication date Feb 15, 2018
- LAM RESEARCH CORPORATION
- Richard H. Gould
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM RELATED TO SEMICONDUCTOR PROCESSING EQUIPMENT
- Publication number 20160163572
- Publication date Jun 9, 2016
- LAM RESEARCH CORPORATION
- Benjamin W. MOORING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM RELATED TO SEMICONDUCTOR PROCESSING EQUIPMENT
- Publication number 20140072397
- Publication date Mar 13, 2014
- LAM RESEARCH CORPORATION
- Benjamin W. MOORING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Heating and Temperature Control by Backside Fluid Injection
- Publication number 20130059260
- Publication date Mar 7, 2013
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC ALIGNMENT OF WAFERS USING COMPENSATION VALUES OBTAINED THRO...
- Publication number 20090279989
- Publication date Nov 12, 2009
- LAM RESEARCH CORPORATION
- Scott Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET CORRECTION TECHNIQUES FOR POSITIONING SUBSTRATES WITHIN A PR...
- Publication number 20090088887
- Publication date Apr 2, 2009
- Jack Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET CORRECTION TECHNIQUES FOR POSITIONING SUBSTRATES
- Publication number 20080081383
- Publication date Apr 3, 2008
- Jack Chen
- G05 - CONTROLLING REGULATING
Information Patent Application
OFFSET CORRECTION METHODS AND ARRANGEMENT FOR POSITIONING AND INSPE...
- Publication number 20080080845
- Publication date Apr 3, 2008
- Jack Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled ambient system for interface engineering
- Publication number 20080057221
- Publication date Mar 6, 2008
- LAM RESEARCH CORPORATION
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR GAP FILL IN CONTROLLED AMBIENT SYSTEM
- Publication number 20080057182
- Publication date Mar 6, 2008
- John Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer heating and temperature control by backside fluid injection
- Publication number 20060130762
- Publication date Jun 22, 2006
- Lam Research Corp.
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS

Benjamin W. Mooring

Person

Patents Grantslast 30 patents

Enhanced automatic wafer centering system and techniques for same

Enhanced automatic wafer centering system and techniques for same

Fiducial-filtering automatic wafer centering process and associated...

Platform architecture to improve system productivity

Method and system related to semiconductor processing equipment

Method and system related to semiconductor processing equipment

Controlled ambient system for interface engineering

Wafer heating and temperature control by backside fluid injection

Wafer heating and temperature control by backside fluid injection

Dynamic alignment of wafers using compensation values obtained thro...

Offset correction techniques for positioning substrates within a pr...

Offset correction methods and arrangement for positioning and inspe...

Offset correction techniques for positioning substrates

Methods and apparatus for determining an average electrical respons...

Method and apparatus for determining substrate offset using optimiz...

Method of and apparatus for dynamic alignment of substrates

Method and apparatus for chemical mechanical planarization and poli...

Modular architecture for semiconductor wafer fabrication equipment

Semiconductor processing platform architecture having processing mo...

Dual sided slot valve and method for implementing the same

Dual plane robot

Patents Applicationslast 30 patents

ENHANCED AUTOMATIC WAFER CENTERING SYSTEM AND TECHNIQUES FOR SAME

ENHANCED AUTOMATIC WAFER CENTERING SYSTEM AND TECHNIQUES FOR SAME

Fiducial-Filtering Automatic Wafer Centering Process and Associated...

PLATFORM ARCHITECTURE TO IMPROVE SYSTEM PRODUCTIVITY

METHOD AND SYSTEM RELATED TO SEMICONDUCTOR PROCESSING EQUIPMENT

METHOD AND SYSTEM RELATED TO SEMICONDUCTOR PROCESSING EQUIPMENT

Wafer Heating and Temperature Control by Backside Fluid Injection

DYNAMIC ALIGNMENT OF WAFERS USING COMPENSATION VALUES OBTAINED THRO...

OFFSET CORRECTION TECHNIQUES FOR POSITIONING SUBSTRATES WITHIN A PR...

OFFSET CORRECTION TECHNIQUES FOR POSITIONING SUBSTRATES

OFFSET CORRECTION METHODS AND ARRANGEMENT FOR POSITIONING AND INSPE...

Controlled ambient system for interface engineering

METHOD FOR GAP FILL IN CONTROLLED AMBIENT SYSTEM

Wafer heating and temperature control by backside fluid injection