Bennett A. Joiner

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced molded package for semiconductors
- Patent number 7,361,985
- Issue date Apr 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic noise shielding in semiconductor packages using cag...
- Patent number 6,933,599
- Issue date Aug 23, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Bennett A. Joiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile semiconductor device having improved heat dissipation
- Patent number 6,847,102
- Issue date Jan 25, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile semiconductor device with like-sized chip and mounting...
- Patent number 5,734,201
- Issue date Mar 31, 1998
- Motorola, Inc.
- Frank Djennas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thermally enhanced lead frame
- Patent number 5,683,944
- Issue date Nov 4, 1997
- Motorola, Inc.
- Bennett A. Joiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drop-in heat sink package with window frame flag
- Patent number 5,483,098
- Issue date Jan 9, 1996
- Motorola, Inc.
- Bennett A. Joiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a thermally enhanced semiconductor device by hold...
- Patent number 5,147,821
- Issue date Sep 15, 1992
- Motorola, Inc.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor device utilizing a vacuum to ultim...
- Patent number 5,105,259
- Issue date Apr 14, 1992
- Motorola, Inc.
- Michael B. McShane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermally enhanced molded package for semiconductors
- Publication number 20060087015
- Publication date Apr 27, 2006
- Freescale Semiconductor Inc.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic noise shielding in semiconductor packages using cag...
- Publication number 20050087856
- Publication date Apr 28, 2005
- Bennett A. Joiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method therefor
- Publication number 20040089922
- Publication date May 13, 2004
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS

Bennett A. Joiner

Person

Patents Grantslast 30 patents

Thermally enhanced molded package for semiconductors

Electromagnetic noise shielding in semiconductor packages using cag...

Low profile semiconductor device having improved heat dissipation

Low profile semiconductor device with like-sized chip and mounting...

Method of fabricating a thermally enhanced lead frame

Drop-in heat sink package with window frame flag

Method for making a thermally enhanced semiconductor device by hold...

Thermally enhanced semiconductor device utilizing a vacuum to ultim...

Patents Applicationslast 30 patents

Thermally enhanced molded package for semiconductors

Electromagnetic noise shielding in semiconductor packages using cag...

Semiconductor device and method therefor