Benny W H Lai

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package
- Patent number 7,227,254
- Issue date Jun 5, 2007
- Agilent Technologies, Inc.
- Nurwati S Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing an integrated circui...
- Patent number 7,001,834
- Issue date Feb 21, 2006
- Agilent Technologies, Inc.
- Nurwati S Devnani
- H01 - BASIC ELECTRIC ELEMENTS