Benoit Besancon

Person

Villard Bonnot, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 11,688,815
- Issue date Jun 27, 2023
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 11,114,312
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 10,833,208
- Issue date Nov 10, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for making a cover for an electronic package and electronic...
- Patent number 10,483,408
- Issue date Nov 19, 2019
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 10,325,784
- Issue date Jun 18, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an encapsulating block locally of smal...
- Patent number 10,186,466
- Issue date Jan 22, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for collective (wafer-scale) fabrication of electronic devic...
- Patent number 9,870,947
- Issue date Jan 16, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an encapsulating block locally of smal...
- Patent number 9,818,664
- Issue date Nov 14, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20210043780
- Publication date Feb 11, 2021
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20200020815
- Publication date Jan 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...
- Publication number 20190252212
- Publication date Aug 15, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...
- Publication number 20180190511
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Alexandre Mas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC...
- Publication number 20180190838
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...
- Publication number 20180190512
- Publication date Jul 5, 2018
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...
- Publication number 20180033710
- Publication date Feb 1, 2018
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...
- Publication number 20180005889
- Publication date Jan 4, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING STACKED DIE AND PASSIVE COMPONENT
- Publication number 20170345805
- Publication date Nov 30, 2017
- STMicroelectronics (Grenoble 2) SAS
- Norbert Chevrier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH ELECTRONIC CHIPS AND HEAT SINK
- Publication number 20170317059
- Publication date Nov 2, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...
- Publication number 20170250119
- Publication date Aug 31, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK
- Publication number 20170127567
- Publication date May 4, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Benoit Besancon

Person

Patents Grantslast 30 patents

Method for manufacturing a cover for an electronic package and elec...

Method for manufacturing an encapsulation cover for an electronic p...

Method for manufacturing a cover for an electronic package and elec...

Method for making a cover for an electronic package and electronic...

Method for manufacturing an encapsulation cover for an electronic p...

Electronic device comprising an encapsulating block locally of smal...

Method for collective (wafer-scale) fabrication of electronic devic...

Electronic device comprising an encapsulating block locally of smal...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...

METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELEC...

METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC...

METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC P...

ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...

METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...

PACKAGE INCLUDING STACKED DIE AND PASSIVE COMPONENT

ELECTRONIC DEVICE WITH ELECTRONIC CHIPS AND HEAT SINK

ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...

ELECTRONIC DEVICE EQUIPPED WITH A HEAT SINK