Benson Q. TONG

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
High power cable for heated components in RF environment
- Patent number 12,217,944
- Issue date Feb 4, 2025
- Lam Research Corporation
- Seyed Jafar Jafarian-Tehrani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power cable for heated components in RF environment
- Patent number 11,837,446
- Issue date Dec 5, 2023
- Lam Research Corporation
- Seyed Jafar Jafarian-Tehrani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PROCESSING WAFERS
- Publication number 20210265136
- Publication date Aug 26, 2021
- LAM RESEARCH CORPORATION
- Ming LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER CABLE FOR HEATED COMPONENTS IN RF ENVIRONMENT
- Publication number 20190035608
- Publication date Jan 31, 2019
- LAM RESEARCH CORPORATION
- Seyed Jafar JAFARIAN-TEHRANI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHAMBER FILLER KIT FOR DIELECTRIC ETCH CHAMBER
- Publication number 20180005851
- Publication date Jan 4, 2018
- LAM RESEARCH CORPORATION
- Benson Q. TONG
- H01 - BASIC ELECTRIC ELEMENTS