Bernard A. Malouin JR.

Person

Westford, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flow-through, hot-spot-targeting immersion cooling assembly
- Patent number 12,048,118
- Issue date Jul 23, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature electronic device thermal management system
- Patent number 11,963,341
- Issue date Apr 16, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct contact fluid based cooling module
- Patent number 11,844,193
- Issue date Dec 12, 2023
- JetCool Technologies, Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular microjet cooling of packaged electronic components
- Patent number 11,594,470
- Issue date Feb 28, 2023
- Massachesetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of RF devices using embedded microjet arrays
- Patent number 11,322,426
- Issue date May 3, 2022
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Re-entrant flow cold plate
- Patent number 11,277,937
- Issue date Mar 15, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct contact fluid based cooling module
- Patent number 11,191,184
- Issue date Nov 30, 2021
- Jetcool Technologies Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular microjet cooling of packaged electronic components
- Patent number 11,018,077
- Issue date May 25, 2021
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of RF devices using embedded microjet arrays
- Patent number 10,903,141
- Issue date Jan 26, 2021
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Modular microjet cooling of packaged electronic components
- Patent number 10,665,529
- Issue date May 26, 2020
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of RF devices using embedded microjet arrays
- Patent number 10,651,112
- Issue date May 12, 2020
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device array backframe with integral manifolding for high performan...
- Patent number 10,512,152
- Issue date Dec 17, 2019
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Actively Cooled Heat-Dissipation Lids for Computer Processors and P...
- Publication number 20240206128
- Publication date Jun 20, 2024
- Jetcool Technologies Inc.
- Bernard MALOUIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High Temperature Electronic Device Thermal Management System
- Publication number 20240090180
- Publication date Mar 14, 2024
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ship-and-Install Electronics Assembly with Multifunctional Interfac...
- Publication number 20230284416
- Publication date Sep 7, 2023
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Actively Cooled Heat-Dissipation Lids for Computer Processors and A...
- Publication number 20230284421
- Publication date Sep 7, 2023
- Jetcool Technologies Inc.
- Bernard MALOUIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Liquid-In-Liquid Cooling System for Electronic Components
- Publication number 20230156959
- Publication date May 18, 2023
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flow-Through, Hot-Spot-Targeting Immersion Cooling Assembly
- Publication number 20230048500
- Publication date Feb 16, 2023
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Re-Entrant Flow Cold Plate
- Publication number 20220408592
- Publication date Dec 22, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT CONTACT FLUID BASED COOLING MODULE
- Publication number 20220338375
- Publication date Oct 20, 2022
- Jetcool Technologies Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Cooling Assembly with Substrate Fluid-Proofing for Multi-...
- Publication number 20220230937
- Publication date Jul 21, 2022
- Jetcool Technologies Inc.
- Bernard MALOUIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Material, Variable Heat Flux Cold Plate
- Publication number 20220117115
- Publication date Apr 14, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Temperature Electronic Device Thermal Management System
- Publication number 20220087076
- Publication date Mar 17, 2022
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular Microjet Cooling Of Packaged Electronic Components
- Publication number 20210265240
- Publication date Aug 26, 2021
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management Of RF Devices Using Embedded Microjet Arrays
- Publication number 20210134703
- Publication date May 6, 2021
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Re-Entrant Flow Cold Plate
- Publication number 20210037676
- Publication date Feb 4, 2021
- Jetcool Technologies Inc.
- Bernard Malouin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microjet-Cooled Flanges for Electronic Devices
- Publication number 20200350233
- Publication date Nov 5, 2020
- Jetcool Technologies, Inc.
- Jordan Mizerak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Contact Fluid Based Cooling Module
- Publication number 20200352053
- Publication date Nov 5, 2020
- Jetcool Technologies, Inc.
- Jordan Mizerak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management of Electronics Using Co-located Microjet Nozzles...
- Publication number 20200343160
- Publication date Oct 29, 2020
- Jetcool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Fluid-Pressure Assisted Coaxial Fluid Elements, Fittings and Assemb...
- Publication number 20200326025
- Publication date Oct 15, 2020
- Jetcool Technologies Inc.
- Bernard Malouin
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Modular Microjet Cooling Of Packaged Electronic Components
- Publication number 20200312746
- Publication date Oct 1, 2020
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management Of RF Devices Using Embedded Microjet Arrays
- Publication number 20200168526
- Publication date May 28, 2020
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Modular Microjet Cooling Of Packaged Electronic Components
- Publication number 20200027819
- Publication date Jan 23, 2020
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Array Backframe With Integral Manifolding For High Performan...
- Publication number 20190029105
- Publication date Jan 24, 2019
- Massachusetts Institute of Technology
- James Paul Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management Of RF Devices Using Embedded Microjet Arrays
- Publication number 20190013258
- Publication date Jan 10, 2019
- Massachusetts Institute of Technology
- Bernard A. Malouin
- F28 - HEAT EXCHANGE IN GENERAL

Bernard A. Malouin JR.

Person

Patents Grantslast 30 patents

Thermal management of electronics using co-located microjet nozzles...

Flow-through, hot-spot-targeting immersion cooling assembly

High temperature electronic device thermal management system

Direct contact fluid based cooling module

Modular microjet cooling of packaged electronic components

Thermal management of RF devices using embedded microjet arrays

Re-entrant flow cold plate

Direct contact fluid based cooling module

Modular microjet cooling of packaged electronic components

Thermal management of RF devices using embedded microjet arrays

Modular microjet cooling of packaged electronic components

Thermal management of RF devices using embedded microjet arrays

Device array backframe with integral manifolding for high performan...

Patents Applicationslast 30 patents

Actively Cooled Heat-Dissipation Lids for Computer Processors and P...

High Temperature Electronic Device Thermal Management System

Ship-and-Install Electronics Assembly with Multifunctional Interfac...

Actively Cooled Heat-Dissipation Lids for Computer Processors and A...

Liquid-In-Liquid Cooling System for Electronic Components

Flow-Through, Hot-Spot-Targeting Immersion Cooling Assembly

Re-Entrant Flow Cold Plate

DIRECT CONTACT FLUID BASED COOLING MODULE

Conformal Cooling Assembly with Substrate Fluid-Proofing for Multi-...

Multi-Material, Variable Heat Flux Cold Plate

High Temperature Electronic Device Thermal Management System

Modular Microjet Cooling Of Packaged Electronic Components

Thermal Management Of RF Devices Using Embedded Microjet Arrays

Re-Entrant Flow Cold Plate

Microjet-Cooled Flanges for Electronic Devices

Direct Contact Fluid Based Cooling Module

Thermal Management of Electronics Using Co-located Microjet Nozzles...

Fluid-Pressure Assisted Coaxial Fluid Elements, Fittings and Assemb...

Modular Microjet Cooling Of Packaged Electronic Components

Thermal Management Of RF Devices Using Embedded Microjet Arrays

Modular Microjet Cooling Of Packaged Electronic Components

Device Array Backframe With Integral Manifolding For High Performan...

Thermal Management Of RF Devices Using Embedded Microjet Arrays