Bernard H. Glasauer

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Saratoga, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
System and method for attaching an integrated circuit package to a...
- Patent number 11,322,367
- Issue date May 3, 2022
- Juniper Networks, Inc.
- Peng Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240170417
- Publication date May 23, 2024
- Juniper Networks, Inc.
- Omar AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH CONDUCTIVE PADS AND CONDUCTIVE LAYERS
- Publication number 20220312591
- Publication date Sep 29, 2022
- Juniper Networks, Inc.
- Peng SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR