BERNARD KAEBIN ANDRES ANCHETA

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Patents Grantslast 30 patents

Information Patent Grant
MCM package isolation through leadframe design and package saw process
- Patent number 11,862,479
- Issue date Jan 2, 2024
- Texas Instruments Incorporated
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip on leadframe having partially etched landing sites
- Patent number 11,233,031
- Issue date Jan 25, 2022
- Texas Instruments Incorporated
- Ronaldo Marasigan Arguelles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MCM package isolation through leadframe design and package saw process
- Patent number 11,081,366
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES
- Publication number 20220149003
- Publication date May 12, 2022
- TEXAS INSTRUMENTS INCORPORATED
- RONALDO MARASIGAN ARGUELLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM Package Isolation Through Leadframe Design and Package Saw Process
- Publication number 20210320014
- Publication date Oct 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE ISOLATION THROUGH LEADFRAME DESIGN AND PACKAGE SAW PROCESS
- Publication number 20200185234
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Bernard Kaebin Andres Ancheta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES
- Publication number 20170170101
- Publication date Jun 15, 2017
- TEXAS INSTRUMENTS INCORPORATED
- RONALDO MARASIGAN ARGUELLES
- H01 - BASIC ELECTRIC ELEMENTS