Bernardo Gallegos

Person

The Colony, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrates with solder barriers on leads
- Patent number 12,237,249
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package terminal cavities
- Patent number 11,244,881
- Issue date Feb 8, 2022
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having organic, polymerizable photo-imageable adhesion layer
- Patent number 10,672,692
- Issue date Jun 2, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming leadframe having organic, polymerizable photo-i...
- Patent number 9,934,989
- Issue date Apr 3, 2018
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging a circuit
- Patent number 9,875,930
- Issue date Jan 23, 2018
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit
- Patent number 9,536,781
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,165,873
- Issue date Oct 20, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,142,496
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of making
- Patent number 9,142,472
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stopping resin bleed and mold flash on int...
- Patent number 9,054,092
- Issue date Jun 9, 2015
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices having die attach regions with selectiv...
- Patent number 8,298,874
- Issue date Oct 30, 2012
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices having die attach regions with selectiv...
- Patent number 8,222,748
- Issue date Jul 17, 2012
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stable gold bump solder connections
- Patent number 7,939,939
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having substrate with differentially plated co...
- Patent number 7,851,928
- Issue date Dec 14, 2010
- Texas Instruments Incorporated
- Bernardo Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip semiconductor device having workpiece adhesion promoter l...
- Patent number 7,808,113
- Issue date Oct 5, 2010
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20250087563
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20220208665
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20220210911
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE TERMINAL CAVITIES
- Publication number 20210098322
- Publication date Apr 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH SOLDER BARRIERS ON LEADS
- Publication number 20200135627
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING LEADFRAME HAVING ORGANIC, POLYMERIZABLE PHOTO-I...
- Publication number 20180096859
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer
- Publication number 20180096860
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING INTEGRATED CIRCUIT
- Publication number 20150357238
- Publication date Dec 10, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AN APPARATUS FOR STOPPING RESIN BLEED AND MOLD FLASH ON INTE...
- Publication number 20150115421
- Publication date Apr 30, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A CIRCUIT
- Publication number 20150111344
- Publication date Apr 23, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075890
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075928
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075894
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVING DIE ATTACH REGIONS WITH SELECTIV...
- Publication number 20120252170
- Publication date Oct 4, 2012
- TEXAS INSTRUMENTS INCORPORATED
- BERNARDO GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Gold Bump Solder Connections
- Publication number 20110177686
- Publication date Jul 21, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE GOLD BUMP SOLDER CONNECTIONS
- Publication number 20110108980
- Publication date May 12, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVNG DIE ATTACH REGIONS WITH SELECTIVE...
- Publication number 20100301493
- Publication date Dec 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- BERNARDO GALLEGOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE HAVING WORKPIECE ADHESION PROMOTER L...
- Publication number 20100007032
- Publication date Jan 14, 2010
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE
- Publication number 20100007015
- Publication date Jan 14, 2010
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SUBSTRATE WITH DIFFERENTIALLY PLATED CO...
- Publication number 20090302463
- Publication date Dec 10, 2009
- TEXAS INSTRUMENTS INCORPORATED
- BERNARDO GALLEGOS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stable Gold Bump Solder Connections
- Publication number 20090091024
- Publication date Apr 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kejun Zeng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical circuit and method of formation
- Publication number 20030183418
- Publication date Oct 2, 2003
- Abram M. Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical circuit and method of formation
- Publication number 20030066679
- Publication date Apr 10, 2003
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS

Bernardo Gallegos

Person

Patents Grantslast 30 patents

Substrates with solder barriers on leads

Semiconductor package with nickel-silver pre-plated leadframe

Stress relief for flip-chip packaged devices

Semiconductor package with nickel-silver pre-plated leadframe

Package terminal cavities

Leadframe having organic, polymerizable photo-imageable adhesion layer

Process for forming leadframe having organic, polymerizable photo-i...

Method of packaging a circuit

Method of making integrated circuit

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Integrated circuit and method of making

Method and apparatus for stopping resin bleed and mold flash on int...

Packaged electronic devices having die attach regions with selectiv...

Packaged electronic devices having die attach regions with selectiv...

Stable gold bump solder connections

Semiconductor device having substrate with differentially plated co...

Flip chip semiconductor device having workpiece adhesion promoter l...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

PACKAGE TERMINAL CAVITIES

SUBSTRATES WITH SOLDER BARRIERS ON LEADS

PROCESS FOR FORMING LEADFRAME HAVING ORGANIC, POLYMERIZABLE PHOTO-I...

Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer

Semiconductor Package Having Etched Foil Capacitor Integrated Into...

METHOD OF MAKING INTEGRATED CIRCUIT

METHOD AN APPARATUS FOR STOPPING RESIN BLEED AND MOLD FLASH ON INTE...

METHOD OF FABRICATING A CIRCUIT

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

PACKAGED ELECTRONIC DEVICES HAVING DIE ATTACH REGIONS WITH SELECTIV...

Stable Gold Bump Solder Connections

STABLE GOLD BUMP SOLDER CONNECTIONS

PACKAGED ELECTRONIC DEVICES HAVNG DIE ATTACH REGIONS WITH SELECTIVE...

FLIP CHIP SEMICONDUCTOR DEVICE HAVING WORKPIECE ADHESION PROMOTER L...

INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE

SEMICONDUCTOR DEVICE HAVING SUBSTRATE WITH DIFFERENTIALLY PLATED CO...

Stable Gold Bump Solder Connections

Electrical circuit and method of formation

Electrical circuit and method of formation