Bernd Betz

Person

Oberhinkofen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,410,906
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing and apparatus for improving the bonding betwe...
- Patent number 7,732,333
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor device components embedded...
- Patent number 7,705,472
- Issue date Apr 27, 2010
- Infineon Technologies, AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit component with passivation layer
- Patent number 7,642,641
- Issue date Jan 5, 2010
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and use of a device for applying coatings to band-like struc...
- Patent number 7,635,612
- Issue date Dec 22, 2009
- Infineon Technologies AG
- Bernd Betz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MID module and a method of mounting an optical fibre in an MID module
- Patent number 7,597,484
- Issue date Oct 6, 2009
- Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Cyrus Ghahremani
- G02 - OPTICS
Information Patent Grant
Radiofrequency power semiconductor module with cavity housing, and...
- Patent number 7,417,198
- Issue date Aug 26, 2008
- Infineon Technologies AG
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20200395266
- Publication date Dec 17, 2020
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Producing and Apparatus for Improving the Bonding Betwe...
- Publication number 20080258281
- Publication date Oct 23, 2008
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID MODULE AND A METHOD OF MOUNTING AN OPTICAL FIBRE IN AN MID MODULE
- Publication number 20080152285
- Publication date Jun 26, 2008
- Avago Technologies, Ltd.
- Cyrus Ghahremani
- G02 - OPTICS
Information Patent Application
Integrated circuit component with passivation layer and methods for...
- Publication number 20080093728
- Publication date Apr 24, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Semiconductor Device Components Embedded...
- Publication number 20070145606
- Publication date Jun 28, 2007
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and use of a device for applying coatings to band-like struc...
- Publication number 20070128371
- Publication date Jun 7, 2007
- Bernd Betz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency power semiconductor module with a hollow housing and...
- Publication number 20060012016
- Publication date Jan 19, 2006
- Bernd Betz
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and method for fabricating a semiconductor pa...

Process for producing and apparatus for improving the bonding betwe...

Semiconductor device with semiconductor device components embedded...

Integrated circuit component with passivation layer

Method and use of a device for applying coatings to band-like struc...

MID module and a method of mounting an optical fibre in an MID module

Radiofrequency power semiconductor module with cavity housing, and...

Patents Applicationslast 30 patents

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Process for Producing and Apparatus for Improving the Bonding Betwe...

MID MODULE AND A METHOD OF MOUNTING AN OPTICAL FIBRE IN AN MID MODULE

Integrated circuit component with passivation layer and methods for...

Semiconductor Device with Semiconductor Device Components Embedded...

Method and use of a device for applying coatings to band-like struc...

High-frequency power semiconductor module with a hollow housing and...