Bernd Foeste

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with lamella defined by singulation trench
- Patent number 9,527,725
- Issue date Dec 27, 2016
- Infineon Technologies AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing a semiconductor structure with forming a sacrif...
- Patent number 8,921,954
- Issue date Dec 30, 2014
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure with lamella defined by singulation trench
- Patent number 8,723,276
- Issue date May 13, 2014
- Infineon Technologies AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 8,627,720
- Issue date Jan 14, 2014
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of providing a semiconductor structure with forming a sacrif...
- Patent number 8,518,732
- Issue date Aug 27, 2013
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor
- Patent number 8,266,962
- Issue date Sep 18, 2012
- Infineon Technologies AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a pressure sensor
- Patent number 7,832,279
- Issue date Nov 16, 2010
- Infineon Technologies AG
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Grant
Test circuit arrangement
- Patent number 7,711,998
- Issue date May 4, 2010
- Infineon Technologies AG
- Bernd Foeste
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LAMELLA DEFINED BY SINGULATION TRENCH
- Publication number 20140227818
- Publication date Aug 14, 2014
- INFINEON TECHNOLOGIES AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...
- Publication number 20130334624
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20130001712
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Providing a Semiconductor Structure with Forming A Sacrif...
- Publication number 20120161254
- Publication date Jun 28, 2012
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Structure with Lamella Defined by Singulation Trench
- Publication number 20110068420
- Publication date Mar 24, 2011
- INFINEON TECHNOLOGIES AG
- Boris Binder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20100186511
- Publication date Jul 29, 2010
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PRESSURE SENSOR
- Publication number 20100058876
- Publication date Mar 11, 2010
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Application
TEST CIRCUIT ARRANGEMENT
- Publication number 20080238437
- Publication date Oct 2, 2008
- Infineon Technologies AG
- BERND FOESTE
- G11 - INFORMATION STORAGE

Bernd Foeste

Person

Patents Grantslast 30 patents

Semiconductor structure with lamella defined by singulation trench

Method of providing a semiconductor structure with forming a sacrif...

Semiconductor structure with lamella defined by singulation trench

Acceleration sensor

Method of providing a semiconductor structure with forming a sacrif...

Acceleration sensor

Semiconductor device including a pressure sensor

Test circuit arrangement

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH LAMELLA DEFINED BY SINGULATION TRENCH

METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...

ACCELERATION SENSOR

Method of Providing a Semiconductor Structure with Forming A Sacrif...

Semiconductor Structure with Lamella Defined by Singulation Trench

ACCELERATION SENSOR

SEMICONDUCTOR DEVICE INCLUDING A PRESSURE SENSOR

TEST CIRCUIT ARRANGEMENT