Bernd Hintze

Person

Langebrueck, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method including a formation of a diffusion barrier and semiconduct...
- Patent number 10,090,195
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal nitride materials
- Patent number 9,177,826
- Issue date Nov 3, 2015
- GLOBALFOUNDRIES Inc.
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits including barrier layer...
- Patent number 9,177,858
- Issue date Nov 3, 2015
- GLOBALFOUNDRIES, INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method including an etching of a portion of an interlayer dielectri...
- Patent number 9,171,754
- Issue date Oct 27, 2015
- GLOBALFOUNDRIES Inc.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting defects in a diffusion barrier layer
- Patent number 9,147,618
- Issue date Sep 29, 2015
- GLOBALFOUNDRIES Inc.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 8,138,538
- Issue date Mar 20, 2012
- Qimonda AG
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a dielectric interlayer and storage capacitor...
- Patent number 7,880,212
- Issue date Feb 1, 2011
- Qimonda AG
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a conductive layer including two metal nitrides
- Patent number 7,531,418
- Issue date May 12, 2009
- Qimonda AG
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a dielectric interlayer and storage capacitor...
- Patent number 7,416,952
- Issue date Aug 26, 2008
- Infineon Technologies AG
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD INCLUDING A FORMATION OF A DIFFUSION BARRIER AND SEMICONDUCT...
- Publication number 20170117179
- Publication date Apr 27, 2017
- GLOBALFOUNDRIES INC.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS INCLUDING BARRIER LAYER...
- Publication number 20150325467
- Publication date Nov 12, 2015
- GLOBALFOUNDRIES, Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN A DIFFUSION BARRIER LAYER
- Publication number 20150111316
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES INC.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING AN ETCHING OF A PORTION OF AN INTERLAYER DIELECTRI...
- Publication number 20140349478
- Publication date Nov 27, 2014
- GLOBALFOUNDRIES INC.
- Frank Koschinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING A REMOVAL OF A HARDMASK FROM A SEMICONDUCTOR STRUC...
- Publication number 20140349479
- Publication date Nov 27, 2014
- Oliver Mieth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING BARRIER LAYERS FOR CONDUCTIVE COPPER STRUCTURES
- Publication number 20140273436
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES INC.
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR FORMING INTEGRATED CIRCUITS WITH POST-PATTERNING TREA...
- Publication number 20140024213
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Nitride Materials
- Publication number 20130203266
- Publication date Aug 8, 2013
- GLOBALFOUNDRIES INC.
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20100090264
- Publication date Apr 15, 2010
- QIMONDA AG
- Hans-Peter Moll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A DIELECTRIC INTERLAYER AND STORAGE CAPACITOR...
- Publication number 20080316675
- Publication date Dec 25, 2008
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING AN INTEGRATED CIRCUIT
- Publication number 20080282535
- Publication date Nov 20, 2008
- QIMONDA AG
- Jonas Sundqvist
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for producing a dielectric interlayer and storage capacitor...
- Publication number 20070272965
- Publication date Nov 29, 2007
- Infineon Technologies AG
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a conductive layer
- Publication number 20060128128
- Publication date Jun 15, 2006
- Infineon Technologies AG
- Bernd Hintze
- H01 - BASIC ELECTRIC ELEMENTS

Bernd Hintze

Person

Patents Grantslast 30 patents

Method including a formation of a diffusion barrier and semiconduct...

Methods of forming metal nitride materials

Methods for fabricating integrated circuits including barrier layer...

Method including an etching of a portion of an interlayer dielectri...

Method for detecting defects in a diffusion barrier layer

Interconnect structure for semiconductor devices

Method for producing a dielectric interlayer and storage capacitor...

Method of producing a conductive layer including two metal nitrides

Method for producing a dielectric interlayer and storage capacitor...

Patents Applicationslast 30 patents

METHOD INCLUDING A FORMATION OF A DIFFUSION BARRIER AND SEMICONDUCT...

METHODS FOR FABRICATING INTEGRATED CIRCUITS INCLUDING BARRIER LAYER...

METHOD FOR DETECTING DEFECTS IN A DIFFUSION BARRIER LAYER

METHOD INCLUDING AN ETCHING OF A PORTION OF AN INTERLAYER DIELECTRI...

METHOD INCLUDING A REMOVAL OF A HARDMASK FROM A SEMICONDUCTOR STRUC...

METHODS OF FORMING BARRIER LAYERS FOR CONDUCTIVE COPPER STRUCTURES

PROCESSES FOR FORMING INTEGRATED CIRCUITS WITH POST-PATTERNING TREA...

Methods of Forming Metal Nitride Materials

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

METHOD FOR PRODUCING A DIELECTRIC INTERLAYER AND STORAGE CAPACITOR...

METHOD OF FABRICATING AN INTEGRATED CIRCUIT

Method for producing a dielectric interlayer and storage capacitor...

Method for producing a conductive layer