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Bernd M. Vollmer
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Wappingers Falls, NY, US
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last 30 patents
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Patent Grant
Method of forming multi-level coplanar metal/insulator films using...
Patent number
6,300,235
Issue date
Oct 9, 2001
Siemens Aktiengesellschaft
Klaus Feldner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing metal interconnect structure for an integra...
Patent number
5,798,301
Issue date
Aug 25, 1998
Siemens Aktiengesellschaft
Pei-Ing Paul Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal interconnect structure for an integrated circuit with improve...
Patent number
5,641,992
Issue date
Jun 24, 1997
Siemens Components, Inc.
Pei-Ing Paul Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of depositing conductors in high aspect ratio apertures unde...
Patent number
5,529,670
Issue date
Jun 25, 1996
International Business Machines Corporation
James G. Ryan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Refractory metal capped low resistivity metal conductor lines and vias
Patent number
5,262,354
Issue date
Nov 16, 1993
International Business Machines Corporation
William J. Cote
H01 - BASIC ELECTRIC ELEMENTS