Bernd Offermann

Person

Hamburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
System with magnetic field shield structure
- Patent number 11,486,742
- Issue date Nov 1, 2022
- NXP B.V.
- Stephan Marauska
- G01 - MEASURING TESTING
Information Patent Grant
Shielded electronic package and method of fabrication
- Patent number 11,482,478
- Issue date Oct 25, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual sensor assembly and method of fabrication
- Patent number 10,942,227
- Issue date Mar 9, 2021
- NXP B.V.
- Bernd Offermann
- G01 - MEASURING TESTING
Information Patent Grant
Press-fit semiconductor device
- Patent number 10,790,220
- Issue date Sep 29, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package with double-sided capacitor attach on same leads and...
- Patent number 9,958,292
- Issue date May 1, 2018
- NXP B.V.
- Bernd Offermann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20220028766
- Publication date Jan 27, 2022
- NXP B.V.
- Crispulo Estira Lictao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM WITH MAGNETIC FIELD SHIELD STRUCTURE
- Publication number 20210048320
- Publication date Feb 18, 2021
- NXP B.V.
- Stephan Marauska
- G01 - MEASURING TESTING
Information Patent Application
DUAL SENSOR ASSEMBLY AND METHOD OF FABRICATION
- Publication number 20200408854
- Publication date Dec 31, 2020
- NXP B.V.
- Bernd Offermann
- G01 - MEASURING TESTING
Information Patent Application
SENSOR PACKAGE, SENSOR ASSEMBLY, AND METHOD OF FABRICATION
- Publication number 20200225067
- Publication date Jul 16, 2020
- NXP B.V.
- Bernd Offermann
- G01 - MEASURING TESTING
Information Patent Application
SENSOR PACKAGE WITH INTEGRATED MAGNETIC SHIELD STRUCTURE
- Publication number 20200158791
- Publication date May 21, 2020
- NXP B.V.
- Stephan Marauska
- G01 - MEASURING TESTING
Information Patent Application
PRESS-FIT SEMICONDCUTOR DEVICE
- Publication number 20200126895
- Publication date Apr 23, 2020
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE WITH DOUBLE-SIDED CAPACITOR ATTACH ON SAME LEADS AND...
- Publication number 20180113001
- Publication date Apr 26, 2018
- NXP B.V.
- Bernd Offermann
- G01 - MEASURING TESTING
Information Patent Application
Rotational Sensor
- Publication number 20170108353
- Publication date Apr 20, 2017
- NXP B.V.
- Bernd Offermann
- G01 - MEASURING TESTING
Information Patent Application
Surface-mounted device with leads
- Publication number 20060258058
- Publication date Nov 16, 2006
- KONINKLILKE PHILIPS ELECTRONICS N.V.
- Bernd Offermann
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Bernd Offermann

Person

Patents Grantslast 30 patents

System with magnetic field shield structure

Shielded electronic package and method of fabrication

Dual sensor assembly and method of fabrication

Press-fit semiconductor device

Sensor package with double-sided capacitor attach on same leads and...

Patents Applicationslast 30 patents

SHIELDED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

SYSTEM WITH MAGNETIC FIELD SHIELD STRUCTURE

DUAL SENSOR ASSEMBLY AND METHOD OF FABRICATION

SENSOR PACKAGE, SENSOR ASSEMBLY, AND METHOD OF FABRICATION

SENSOR PACKAGE WITH INTEGRATED MAGNETIC SHIELD STRUCTURE

PRESS-FIT SEMICONDCUTOR DEVICE

SENSOR PACKAGE WITH DOUBLE-SIDED CAPACITOR ATTACH ON SAME LEADS AND...

Rotational Sensor

Surface-mounted device with leads