Bernd Roelfs

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Copper plating bath composition
- Patent number 9,551,080
- Issue date Jan 24, 2017
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanic process for filling through-holes with metals, in particul...
- Patent number 9,526,183
- Issue date Dec 20, 2016
- Atotech Deutschland GmbH
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for copper plating
- Patent number 9,506,158
- Issue date Nov 29, 2016
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Galvanic process for filling through-holes with metals, in particul...
- Patent number 9,445,510
- Issue date Sep 13, 2016
- Atotech Deutschland GmbH
- Bert Reents
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic method for filling holes and cavities with metals
- Patent number 8,784,634
- Issue date Jul 22, 2014
- Atotech Deutschland GmbH
- Bert Reents
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aqueous, acid bath and method for the electrolytic deposition of co...
- Patent number 8,679,316
- Issue date Mar 25, 2014
- Atotech Deutschland GmbH
- Heiko Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICUL...
- Publication number 20160270241
- Publication date Sep 15, 2016
- Atotech Deutschland GmbH
- Bert REENTS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PLATING BATH COMPOSITION
- Publication number 20150299883
- Publication date Oct 22, 2015
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING MATT COPPER DEPOSITS
- Publication number 20150014177
- Publication date Jan 15, 2015
- Atotech Deutschland GmbH
- Stefan Kretschmer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR COPPER PLATING
- Publication number 20140102910
- Publication date Apr 17, 2014
- Atotech Deutschland GmbH
- Dirk Rohde
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Aqueous, Acid Bath and Method for the Electrolytic Deposition of Co...
- Publication number 20110011746
- Publication date Jan 20, 2011
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic Method For Filling Holes and Cavities With Metals
- Publication number 20090301889
- Publication date Dec 10, 2009
- Atotech Deutschland GmbH
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Galvanic process for filling through-holes with metals, in particul...
- Publication number 20090236230
- Publication date Sep 24, 2009
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Bernd Roelfs

Person

Patents Grantslast 30 patents

Copper plating bath composition

Galvanic process for filling through-holes with metals, in particul...

Method for copper plating

Galvanic process for filling through-holes with metals, in particul...

Electrolytic method for filling holes and cavities with metals

Aqueous, acid bath and method for the electrolytic deposition of co...

Patents Applicationslast 30 patents

GALVANIC PROCESS FOR FILLING THROUGH-HOLES WITH METALS, IN PARTICUL...

COPPER PLATING BATH COMPOSITION

METHOD FOR PRODUCING MATT COPPER DEPOSITS

METHOD FOR COPPER PLATING

Aqueous, Acid Bath and Method for the Electrolytic Deposition of Co...

Electrolytic Method For Filling Holes and Cavities With Metals

Galvanic process for filling through-holes with metals, in particul...