Bernd Roemer

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Bernhardswald, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing a semiconductor device and a semiconductor device
- Patent number 10,020,285
- Issue date Jul 10, 2018
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement
- Patent number 9,412,626
- Issue date Aug 9, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements and methods for manufacturing a chip arrangement
- Patent number 9,184,066
- Issue date Nov 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a semiconductor stack, and methods for it...
- Patent number 7,456,495
- Issue date Nov 25, 2008
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Producing a Semiconductor Device and a Semiconductor Device
- Publication number 20160071819
- Publication date Mar 10, 2016
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20160064255
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140138803
- Publication date May 22, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module with a semiconductor stack, and methods for it...
- Publication number 20050133932
- Publication date Jun 23, 2005
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS