Bernd Sauter

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Emmerting, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a semiconductor wafer which is coated on o...
- Patent number 6,051,498
- Issue date Apr 18, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for a semiconductor wafer and use of the carrier
- Patent number 5,911,461
- Issue date Jun 15, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Bernd Sauter
- H01 - BASIC ELECTRIC ELEMENTS