Bernd Stadler

Person

Donaustauff, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor module
- Patent number 9,177,879
- Issue date Nov 3, 2015
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded semiconductor package with backside die metallization
- Patent number 9,099,454
- Issue date Aug 4, 2015
- Infineon Technologies AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a micro-electro-mechanical microphone
- Patent number 8,767,983
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module
- Patent number 8,130,506
- Issue date Mar 6, 2012
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip carrier and system including a chip carrier and semiconductor...
- Patent number 7,635,911
- Issue date Dec 22, 2009
- Infineon Technologies AG
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip comprising a movable element
- Patent number 7,557,417
- Issue date Jul 7, 2009
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Digital camera with a transparent core disposed between a lens and...
- Patent number 7,453,509
- Issue date Nov 18, 2008
- Infineon Technologies AG
- Reinhard Losehand
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multilayer circuit carrier, panel, electronic device, and method fo...
- Patent number 7,221,048
- Issue date May 22, 2007
- Infineon Technologies AG
- Frank Daeche
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic sensor device and method for producing the electronic se...
- Patent number 7,056,764
- Issue date Jun 6, 2006
- Infineon Technologies AG
- Albert Auburger
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device having a trimming possibility and at least one se...
- Patent number 6,784,551
- Issue date Aug 31, 2004
- Infineon Technologies AG
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covering device for ceramic modules
- Patent number 6,614,661
- Issue date Sep 2, 2003
- Infineon Technologies AG
- Christian Gottswinter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Handling and mounting protection device
- Patent number 6,433,280
- Issue date Aug 13, 2002
- Infineon Technologies AG
- Jürgen Winterer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensor component
- Patent number 6,313,514
- Issue date Nov 6, 2001
- Infineon Technologies AG
- Jürgen Winterer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor component and production method
- Patent number 6,201,467
- Issue date Mar 13, 2001
- Infineon Technologies AG
- Jürgen Winterer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor sensor component
- Patent number 6,186,008
- Issue date Feb 13, 2001
- Siemens Aktiengesellschaft
- Thies Janczek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component housing for surface mounting of a semiconductor component
- Patent number 6,058,020
- Issue date May 2, 2000
- Siemens Aktiengesellschaft
- Jurgen Winterer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
- Publication number 20170283247
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Molded Semiconductor Package with Backside Die Metallization
- Publication number 20150041967
- Publication date Feb 12, 2015
- INFINEON TECHNOLOGIES AG
- Ulrich Wachter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR MODULE
- Publication number 20120162948
- Publication date Jun 28, 2012
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR MODULE
- Publication number 20090313817
- Publication date Dec 24, 2009
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MODULE INCLUDING A MICRO-ELECTRO-MECHANICAL MICROPHONE
- Publication number 20080298621
- Publication date Dec 4, 2008
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Module comprising a semiconductor chip comprising a movable element
- Publication number 20080197485
- Publication date Aug 21, 2008
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip carrier and system including a chip carrier and semiconductor...
- Publication number 20060192296
- Publication date Aug 31, 2006
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer circuit carrier, panel, electronic device, and method fo...
- Publication number 20050151246
- Publication date Jul 14, 2005
- Frank Daeche
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Digital camera with a light-sensitive sensor
- Publication number 20040095502
- Publication date May 20, 2004
- Reinhard Losehand
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Electronic device having a trimming possibility and at least one se...
- Publication number 20030057446
- Publication date Mar 27, 2003
- Albert Auburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic sensor device and method for producing the electronic se...
- Publication number 20030052702
- Publication date Mar 20, 2003
- Albert Auburger
- G01 - MEASURING TESTING
Information Patent Application
Covering device for ceramic modules
- Publication number 20020051344
- Publication date May 2, 2002
- Christian Gottswinter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Handling and mounting protection device
- Publication number 20010024359
- Publication date Sep 27, 2001
- Jurgen Winterer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing a pressure sensor component
- Publication number 20010002119
- Publication date May 31, 2001
- Siemens Aktiengesellschaft
- Jurgen Winterer
- G01 - MEASURING TESTING

Bernd Stadler

Person

Patents Grantslast 30 patents

Sensor module

Molded semiconductor package with backside die metallization

Module including a micro-electro-mechanical microphone

Sensor module

Chip carrier and system including a chip carrier and semiconductor...

Module comprising a semiconductor chip comprising a movable element

Digital camera with a transparent core disposed between a lens and...

Multilayer circuit carrier, panel, electronic device, and method fo...

Electronic sensor device and method for producing the electronic se...

Electronic device having a trimming possibility and at least one se...

Covering device for ceramic modules

Handling and mounting protection device

Pressure sensor component

Pressure sensor component and production method

Semiconductor sensor component

Component housing for surface mounting of a semiconductor component

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE

Molded Semiconductor Package with Backside Die Metallization

SENSOR MODULE

SENSOR MODULE

MODULE INCLUDING A MICRO-ELECTRO-MECHANICAL MICROPHONE

Module comprising a semiconductor chip comprising a movable element

Chip carrier and system including a chip carrier and semiconductor...

Multilayer circuit carrier, panel, electronic device, and method fo...

Digital camera with a light-sensitive sensor

Electronic device having a trimming possibility and at least one se...

Electronic sensor device and method for producing the electronic se...

Covering device for ceramic modules

Handling and mounting protection device

Method of producing a pressure sensor component