Bernhard DRUMMER

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Tegernheim, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of dicing a wafer and semiconductor chip
- Patent number 9,911,655
- Issue date Mar 6, 2018
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer and semiconductor chip
- Patent number 9,570,352
- Issue date Feb 14, 2017
- Infineon Technologies AG
- Markus Brunnbauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
- Publication number 20170110371
- Publication date Apr 20, 2017
- INFINEON TECHNOLOGIES AG
- Markus BRUNNBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING A WAFER AND SEMICONDUCTOR CHIP
- Publication number 20160211178
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Markus BRUNNBAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARD MODULE
- Publication number 20070170564
- Publication date Jul 26, 2007
- Infineon Technologies AG
- BERNHARD DRUMMER
- G06 - COMPUTING CALCULATING COUNTING