Bernhard Goller

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing and reuse of semiconductor substrates
- Patent number 12,249,504
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device having a second semicond...
- Patent number 12,211,703
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method with mechanical dicing process for producing MEMS components
- Patent number 12,060,266
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of porosifying part of a semiconductor wafer
- Patent number 11,810,779
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device
- Patent number 11,742,215
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
- Patent number 11,712,749
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for partially removing a semiconductor wafer
- Patent number 11,404,262
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor surface smoothing and semiconductor arrangement
- Patent number 11,373,857
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including back-side conductive layer
- Patent number 11,328,955
- Issue date May 10, 2022
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,139,375
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support table, support table assembly, processing arrangement, and...
- Patent number 11,088,009
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Bernhard Goller
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of forming oxygen inserted Si-layers in power semiconductor...
- Patent number 11,031,466
- Issue date Jun 8, 2021
- Infineon Technologies Austria AG
- Martin Poelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a silicon carbide wafer, and a silicon carbi...
- Patent number 10,903,078
- Issue date Jan 26, 2021
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power devices with oxygen inserted Si-layers
- Patent number 10,868,172
- Issue date Dec 15, 2020
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical trench power devices with oxygen inserted Si-layers
- Patent number 10,861,966
- Issue date Dec 8, 2020
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including self-aligned, back-side conductive lay...
- Patent number 10,784,161
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery, integrated circuit and method of manufacturing a battery
- Patent number 10,749,216
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen inserted Si-layers for reduced substrate dopant outdiffusion...
- Patent number 10,741,638
- Issue date Aug 11, 2020
- Infineon Technologies Austria AG
- Martin Poelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor wafer including a porous lay...
- Patent number 10,714,377
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen inserted Si-layers for reduced contact implant outdiffusion...
- Patent number 10,580,888
- Issue date Mar 3, 2020
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen inserted Si-layers in vertical trench power devices
- Patent number 10,573,742
- Issue date Feb 25, 2020
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel, a method for fabricating a panel and a method
- Patent number 10,530,018
- Issue date Jan 7, 2020
- Infineon Technoogies AG
- Denis Lenardic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantable vessel fluid sensor
- Patent number 10,433,736
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Kamil Karlovsky
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Metallization layers for semiconductor devices and methods of formi...
- Patent number 10,439,062
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a planarizable workpiece support, a workpiece...
- Patent number 10,199,255
- Issue date Feb 5, 2019
- Infineon Technologioes AG
- Ingo Muri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery electrode, battery, and method for manufacturing a battery...
- Patent number 10,170,746
- Issue date Jan 1, 2019
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor workpiece
- Patent number 10,157,765
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a lithium ion battery
- Patent number 9,929,438
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Kamil Karlovsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20250183031
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCT...
- Publication number 20240030032
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Saurabh ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240006218
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device Having a Second Semicond...
- Publication number 20230395394
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20230330769
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL NITRIDE LAYER AND A METHOD OF MANUF...
- Publication number 20230238442
- Publication date Jul 27, 2023
- INFINEON TECHNOLOGIES AG
- Ravi Keshav JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES
- Publication number 20230127556
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER
- Publication number 20220310380
- Publication date Sep 29, 2022
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device
- Publication number 20220037165
- Publication date Feb 3, 2022
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING
- Publication number 20210391218
- Publication date Dec 16, 2021
- Felix Johannes Heinrich Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...
- Publication number 20210391377
- Publication date Dec 16, 2021
- Alexander Frey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD WITH MECHANICAL DICING PROCESS FOR PRODUCING MEMS COMPONENTS
- Publication number 20210253421
- Publication date Aug 19, 2021
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20210053148
- Publication date Feb 25, 2021
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING BACK-SIDE CONDUCTIVE LAYER
- Publication number 20200365457
- Publication date Nov 19, 2020
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SURFACE SMOOTHING AND SEMICONDUCTOR ARRANGEMENT
- Publication number 20200365385
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Bernhard GOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Oxygen Inserted Si-Layers in Power Semiconductor...
- Publication number 20200303498
- Publication date Sep 24, 2020
- Martin Poelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20200286730
- Publication date Sep 10, 2020
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Partially Removing a Semiconductor Wafer
- Publication number 20200168449
- Publication date May 28, 2020
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Power Devices with Oxygen Inserted Si-Layers
- Publication number 20200127134
- Publication date Apr 23, 2020
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Trench Power Devices with Oxygen Inserted Si-Layers
- Publication number 20200127135
- Publication date Apr 23, 2020
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXYGEN INSERTED SI-LAYERS FOR REDUCED CONTACT IMPLANT OUTDIFFUSION...
- Publication number 20200052109
- Publication date Feb 13, 2020
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxygen Inserted Si-Layers in Vertical Trench Power Devices
- Publication number 20200052110
- Publication date Feb 13, 2020
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Oxygen Inserted Si-Layers for Reduced Substrate Dopant Outdiffusion...
- Publication number 20200052066
- Publication date Feb 13, 2020
- Infineon Technologies Austria AG
- Martin Poelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Table, Support Table Assembly, Processing Arrangement, and...
- Publication number 20200027774
- Publication date Jan 23, 2020
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...
- Publication number 20190362972
- Publication date Nov 28, 2019
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Including Self-Aligned, Back-Side Conductive Lay...
- Publication number 20190096758
- Publication date Mar 28, 2019
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Wafer Including a Porous Lay...
- Publication number 20190074212
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization Layers for Semiconductor Devices and Methods of Formi...
- Publication number 20180076321
- Publication date Mar 15, 2018
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS

Bernhard Goller

Person

Patents Grantslast 30 patents

Manufacturing and reuse of semiconductor substrates

Methods for forming a semiconductor device having a second semicond...

Method with mechanical dicing process for producing MEMS components

Semiconductor device with a porous portion, wafer composite and met...

Method of porosifying part of a semiconductor wafer

Methods for forming a semiconductor device

Parent substrate, wafer composite and methods of manufacturing crys...

Semiconductor device with a porous portion, wafer composite and met...

Method for partially removing a semiconductor wafer

Semiconductor surface smoothing and semiconductor arrangement

Semiconductor chip including back-side conductive layer

Semiconductor device and method of manufacturing a semiconductor de...

Support table, support table assembly, processing arrangement, and...

Method of forming oxygen inserted Si-layers in power semiconductor...

Methods for processing a silicon carbide wafer, and a silicon carbi...

Vertical power devices with oxygen inserted Si-layers

Vertical trench power devices with oxygen inserted Si-layers

Semiconductor chip including self-aligned, back-side conductive lay...

Battery, integrated circuit and method of manufacturing a battery

Oxygen inserted Si-layers for reduced substrate dopant outdiffusion...

Semiconductor device and semiconductor wafer including a porous lay...

Oxygen inserted Si-layers for reduced contact implant outdiffusion...

Oxygen inserted Si-layers in vertical trench power devices

Panel, a method for fabricating a panel and a method

Implantable vessel fluid sensor

Metallization layers for semiconductor devices and methods of formi...

Method for providing a planarizable workpiece support, a workpiece...

Battery electrode, battery, and method for manufacturing a battery...

Methods for processing a semiconductor workpiece

Method of manufacturing a lithium ion battery

Patents Applicationslast 30 patents

METHOD OF PROCESSING A SEMICONDUCTOR WAFER

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

METHOD FOR MANUFACTURING A CONTACT ON A SILICON CARBIDE SEMICONDUCT...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Methods for Forming a Semiconductor Device Having a Second Semicond...

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

SEMICONDUCTOR DEVICE WITH METAL NITRIDE LAYER AND A METHOD OF MANUF...

MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER

Methods for Forming a Semiconductor Device

SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING

METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...

METHOD WITH MECHANICAL DICING PROCESS FOR PRODUCING MEMS COMPONENTS

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

SEMICONDUCTOR CHIP INCLUDING BACK-SIDE CONDUCTIVE LAYER

SEMICONDUCTOR SURFACE SMOOTHING AND SEMICONDUCTOR ARRANGEMENT

Method of Forming Oxygen Inserted Si-Layers in Power Semiconductor...

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Method for Partially Removing a Semiconductor Wafer

Vertical Power Devices with Oxygen Inserted Si-Layers

Vertical Trench Power Devices with Oxygen Inserted Si-Layers

OXYGEN INSERTED SI-LAYERS FOR REDUCED CONTACT IMPLANT OUTDIFFUSION...

Oxygen Inserted Si-Layers in Vertical Trench Power Devices

Oxygen Inserted Si-Layers for Reduced Substrate Dopant Outdiffusion...

Support Table, Support Table Assembly, Processing Arrangement, and...

Methods for Processing a Silicon Carbide Wafer, and a Silicon Carbi...

Semiconductor Chip Including Self-Aligned, Back-Side Conductive Lay...

Semiconductor Device and Semiconductor Wafer Including a Porous Lay...

Metallization Layers for Semiconductor Devices and Methods of Formi...