Bernhard Lange

Person

Fresiling, DE

People

Patents Grantslast 30 patents

Information Patent Grant
O-ring seals for fluid sensing
- Patent number 11,837,513
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing fluid sensing packages
- Patent number 11,525,820
- Issue date Dec 13, 2022
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE48420
- Issue date Feb 2, 2021
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE46618
- Issue date Nov 28, 2017
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
- Patent number RE46466
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Bernhard P. Lange
Information Patent Grant
System in package and method for manufacturing the same
- Patent number 8,884,343
- Issue date Nov 11, 2014
- Texas Instruments Incorporated
- Bernhard Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-pull back pad package with an additional solder standoff
- Patent number 8,232,144
- Issue date Jul 31, 2012
- Texas Instuments Incorporated
- Bernhard P Lange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High power integrated circuit device having bump pads
- Patent number 8,154,117
- Issue date Apr 10, 2012
- Texas Instruments Incorporated
- Stefan W. Wiktor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi lead frame power package
- Patent number 8,053,876
- Issue date Nov 8, 2011
- Texas Instruments Incorporated
- Steven A Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package with advanced electrical and thermal properties f...
- Patent number 7,863,098
- Issue date Jan 4, 2011
- Texas Instruments Incorporated
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved high current performance
- Patent number 7,808,088
- Issue date Oct 5, 2010
- Texas Instruments Incorporated
- Bernhard P Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and mold compound interlock in packaged semiconductor device
- Patent number 7,741,704
- Issue date Jun 22, 2010
- Texas Instruments Incorporated
- Bernhard Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-pull back pad package with an additional solder standoff
- Patent number 7,608,484
- Issue date Oct 27, 2009
- Texas Instruments Incorporated
- Bernhard P. Lange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and method of manufacture thereof
- Patent number 7,531,895
- Issue date May 12, 2009
- Texas Instruments Incorporated
- Bernhard Lange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package with advanced electrical and thermal properties f...
- Patent number 7,476,976
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
O-RING SEALS FOR FLUID SENSING
- Publication number 20240128137
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
O-RING SEALS FOR FLUID SENSING
- Publication number 20210020528
- Publication date Jan 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian MEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING FLUID SENSING PACKAGES
- Publication number 20200185282
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian MEIER
- G01 - MEASURING TESTING
Information Patent Application
System in Package and Method for Manufacturing The Same
- Publication number 20130221526
- Publication date Aug 29, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE AND METHOD FOR PROVIDING A CHIP MODULE
- Publication number 20120211895
- Publication date Aug 23, 2012
- Texas Instruments Deutschland GmbH
- Bernhard LANGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RFID TRANSPONDER AND METHOD FOR CONNECTING A SEMICONDUCTOR DIE TO A...
- Publication number 20120193801
- Publication date Aug 2, 2012
- Texas Instruments Deutschland GmbH
- Johann Gross
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device and Method for Inert Gas Cure for Leadframe or Substrate Strips
- Publication number 20110189383
- Publication date Aug 4, 2011
- Texas Instruments Deutschland GmbH
- Bernhard P. LANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER INTEGRATED CIRCUIT DEVICE
- Publication number 20100164052
- Publication date Jul 1, 2010
- TEXAS INSTRUMENTS INCORPORATED
- STEFAN W. WIKTOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi Lead Frame Power Package
- Publication number 20100019361
- Publication date Jan 28, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Steven A. Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Pull Back Pad Package with an Additional Solder Standoff
- Publication number 20100006623
- Publication date Jan 14, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP CHIP PACKAGE WITH ADVANCED ELECTRICAL AND THERMAL PROPERTIES F...
- Publication number 20090087948
- Publication date Apr 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. LANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Pull Back Pad Package with an Additional Solder Standoff
- Publication number 20080102563
- Publication date May 1, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LEADFRAME AND MOLD COMPOUND INTERLOCK IN PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20080093715
- Publication date Apr 24, 2008
- Texas Instruments Deutschland GmbH
- Bernhard Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor dies and methods and apparatus to mold lock a semicon...
- Publication number 20080073757
- Publication date Mar 27, 2008
- Steven Alfred Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi Lead Frame Power Package
- Publication number 20080020517
- Publication date Jan 24, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Steven A. Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposed top side copper leadframe manufacturing
- Publication number 20080001264
- Publication date Jan 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LEADFRAME SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20070290303
- Publication date Dec 20, 2007
- Texas Instruments Deutschland GmbH
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Grinding a Wafer
- Publication number 20070287363
- Publication date Dec 13, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor Device with Improved High Current Performance
- Publication number 20070284709
- Publication date Dec 13, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Design and Method for Attaching a Die to a Leadframe in a Semicondu...
- Publication number 20070273010
- Publication date Nov 29, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey G. Holloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20070057361
- Publication date Mar 15, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard Lange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package with advanced electrical and thermal properties f...
- Publication number 20060186551
- Publication date Aug 24, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold cavity identification markings for IC packages
- Publication number 20060166381
- Publication date Jul 27, 2006
- Bernhard P. Lange
- H01 - BASIC ELECTRIC ELEMENTS

Bernhard Lange

Person

Patents Grantslast 30 patents

O-ring seals for fluid sensing

Manufacturing fluid sensing packages

Method for fabricating low resistance, low inductance interconnecti...

Method for fabricating low resistance, low inductance interconnecti...

Method for fabricating low resistance, low inductance interconnecti...

System in package and method for manufacturing the same

Non-pull back pad package with an additional solder standoff

High power integrated circuit device having bump pads

Multi lead frame power package

Flip chip package with advanced electrical and thermal properties f...

Semiconductor device with improved high current performance

Leadframe and mold compound interlock in packaged semiconductor device

Non-pull back pad package with an additional solder standoff

Integrated circuit package and method of manufacture thereof

Flip chip package with advanced electrical and thermal properties f...

Patents Applicationslast 30 patents

O-RING SEALS FOR FLUID SENSING

O-RING SEALS FOR FLUID SENSING

MANUFACTURING FLUID SENSING PACKAGES

System in Package and Method for Manufacturing The Same

CHIP MODULE AND METHOD FOR PROVIDING A CHIP MODULE

RFID TRANSPONDER AND METHOD FOR CONNECTING A SEMICONDUCTOR DIE TO A...

Device and Method for Inert Gas Cure for Leadframe or Substrate Strips

HIGH POWER INTEGRATED CIRCUIT DEVICE

Multi Lead Frame Power Package

Non-Pull Back Pad Package with an Additional Solder Standoff

FLIP CHIP PACKAGE WITH ADVANCED ELECTRICAL AND THERMAL PROPERTIES F...

Non-Pull Back Pad Package with an Additional Solder Standoff

LEADFRAME AND MOLD COMPOUND INTERLOCK IN PACKAGED SEMICONDUCTOR DEVICE

Semiconductor dies and methods and apparatus to mold lock a semicon...

Multi Lead Frame Power Package

Exposed top side copper leadframe manufacturing

DUAL LEADFRAME SEMICONDUCTOR DEVICE PACKAGE

Apparatus for Grinding a Wafer

Semiconductor Device with Improved High Current Performance

Design and Method for Attaching a Die to a Leadframe in a Semicondu...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE THEREOF

Flip chip package with advanced electrical and thermal properties f...

Mold cavity identification markings for IC packages