Bernhard Rebhan

Person

Haag a. H., AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for permanent bonding
- Patent number 9,947,638
- Issue date Apr 17, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for determining the pressure distribution for bon...
- Patent number 9,500,541
- Issue date Nov 22, 2016
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- B30 - PRESSES
Information Patent Grant
Device and method for bonding substrates
- Patent number 9,443,820
- Issue date Sep 13, 2016
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for coating and bonding substrates
- Patent number 9,358,765
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for permanent bonding of wafers, as well as cutti...
- Patent number 9,067,363
- Issue date Jun 30, 2015
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE AND METHOD FOR PERMANENT BONDING
- Publication number 20170053892
- Publication date Feb 23, 2017
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SAC...
- Publication number 20160071817
- Publication date Mar 10, 2016
- EV GROUP E. THALLNER GMBH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING AND BONDING SUBSTRATES
- Publication number 20150224755
- Publication date Aug 13, 2015
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20150069115
- Publication date Mar 12, 2015
- EV GROUP E. THALLNER GMBH
- Bernhard Rebhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS, AS WELL AS CUTTI...
- Publication number 20140196842
- Publication date Jul 17, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR DETERMINING THE PRESSURE DISTRIBUTION FOR BON...
- Publication number 20140102221
- Publication date Apr 17, 2014
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- G01 - MEASURING TESTING

Bernhard Rebhan

Person

Patents Grantslast 30 patents

Method for permanently bonding wafers by a connecting layer by mean...

Device and method for permanent bonding

Method for bonding metallic contact areas with solution of a sacrif...

Method and device for determining the pressure distribution for bon...

Device and method for bonding substrates

Method for coating and bonding substrates

Method and device for permanent bonding of wafers, as well as cutti...

Patents Applicationslast 30 patents

DEVICE AND METHOD FOR PERMANENT BONDING

METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SAC...

METHOD FOR COATING AND BONDING SUBSTRATES

DEVICE AND METHOD FOR BONDING SUBSTRATES

METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS, AS WELL AS CUTTI...

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

METHOD AND DEVICE FOR DETERMINING THE PRESSURE DISTRIBUTION FOR BON...