Bernhard STERING

Person

Stainz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing optical sensor arrangements and housing fo...
- Patent number 10,978,507
- Issue date Apr 13, 2021
- ams AG
- Sonja Koenig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method
- Patent number 10,256,147
- Issue date Apr 9, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a bump contact on a TSV comprising a cavi...
- Patent number 10,217,715
- Issue date Feb 26, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting a carrier for electrical components
- Patent number 9,961,777
- Issue date May 1, 2018
- AMS AG
- Bernhard Stering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method for wafer-level packaging and semiconductor chip with...
- Patent number 9,917,012
- Issue date Mar 13, 2018
- AMS AG
- Bernhard Stering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising an emitter of radiation and a photo...
- Patent number 9,842,946
- Issue date Dec 12, 2017
- AMS AG
- Rainer Minixhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing thin semiconductor components
- Patent number 9,105,645
- Issue date Aug 11, 2015
- AMS AG
- Bernhard Stering
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Manufacturing Optical Sensor Arrangements And Housing F...
- Publication number 20190267424
- Publication date Aug 29, 2019
- ams AG
- Sonja KOENIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR WAFER-LEVEL PACKAGING AND SEMICONDUCTOR CHIP WITH...
- Publication number 20170200647
- Publication date Jul 13, 2017
- ams AG
- Bernhard STERING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A BUMP CONTACT ON A TSV COMPRISING A CAVI...
- Publication number 20170179056
- Publication date Jun 22, 2017
- ams AG
- Martin SCHREMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING AN EMITTER OF RADIATION AND A PHOTO...
- Publication number 20170125613
- Publication date May 4, 2017
- ams AG
- Rainer MINIXHOFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD
- Publication number 20170062277
- Publication date Mar 2, 2017
- ams AG
- Martin SCHREMS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING THIN SEMICONDUCTOR COMPONENTS
- Publication number 20140349462
- Publication date Nov 27, 2014
- ams AG
- Bernhard Stering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CUTTING A CARRIER FOR ELECTRICAL COMPONENTS
- Publication number 20140118974
- Publication date May 1, 2014
- ams AG
- Bernhard Stering
- H01 - BASIC ELECTRIC ELEMENTS

Bernhard STERING

Person

Patents Grantslast 30 patents

Method for manufacturing optical sensor arrangements and housing fo...

Dicing method

Semiconductor device with a bump contact on a TSV comprising a cavi...

Method for cutting a carrier for electrical components

Dicing method for wafer-level packaging and semiconductor chip with...

Semiconductor device comprising an emitter of radiation and a photo...

Method for producing thin semiconductor components

Patents Applicationslast 30 patents

Method for Manufacturing Optical Sensor Arrangements And Housing F...

DICING METHOD FOR WAFER-LEVEL PACKAGING AND SEMICONDUCTOR CHIP WITH...

SEMICONDUCTOR DEVICE WITH A BUMP CONTACT ON A TSV COMPRISING A CAVI...

SEMICONDUCTOR DEVICE COMPRISING AN EMITTER OF RADIATION AND A PHOTO...

DICING METHOD

METHOD FOR PRODUCING THIN SEMICONDUCTOR COMPONENTS

METHOD FOR CUTTING A CARRIER FOR ELECTRICAL COMPONENTS